HEAT DISSIPATING STRUCTURE OF ELECTRONIC APPARATUS

• US 20130063899A1
• Filed: 01/24/2011
• Published: 03/14/2013
• Est. Priority Date: 05/24/2010
• Status: Abandoned Application

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Kuroda, Tatsuro
• Application Number:
  US13/698,710
• Publication Number:
  US 20130063899A1
• Time in Patent Office: Days
• US Class Current: 361/718
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20454 with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste

Abstract

Disclosed is a heat dissipation structure of an electronic device that has an IC chip that is a heat generating element mounted on a substrate and a heat dissipation sheet disposed between the IC chip and a cover member so as to dissipate heat. In such a heat dissipation structure, even if variation in a gap between the IC chip and the cover member is generated, the heat dissipation sheet can come in contact with the IC chip and with the cover member with appropriate pressure. This way, heat is sufficiently dissipated, and therefore, reliability of the electronic device can be improved. A heat dissipation sheet (1) has a double-layered structure in which a first heat dissipation sheet (11) and a second heat dissipation sheet (12) are laminated in a thickness direction. A rubber hardness of the first heat dissipation sheet is set different from that of the second heat dissipating sheet, and a softer heat dissipation sheet and a harder heat dissipation sheet are laminated in a direction of the gap between an IC chip (3) and a cover member (4).

Claims

1. A heat dissipation structure of an electronic device, comprising:

a substrate having an IC chip, which is an electronic component that becomes a heat generating element, mounted thereon;

a cover member that covers a mounting surface of the substrate and that has a heat dissipation characteristic; and

a heat dissipation sheet interposed and pressed between the IC chip and the cover member, the heat dissipation structure dissipating heat through the heat dissipation sheet and the cover member,

wherein the heat dissipation sheet has a double-layered structure in which a first dissipation sheet and a second heat dissipation sheet are laminated in a thickness direction, and

wherein a rubber hardness of the first heat dissipation sheet differs from that of the second heat dissipation sheet so that a softer heat dissipation sheet and a harder heat dissipation sheet are laminated in a direction of a gap between the IC chip and the cover member.

2. The heat dissipation structure of the electronic device according to claim 1,

wherein the first heat dissipation sheet has a chip contact surface with which the IC chip comes in contact and a bonding surface on which the second heat dissipation sheet is bonded, the second heat dissipation sheet has a bonding surface on which the first heat dissipation sheet is bonded and a cover contact surface with which the cover member comes in contact, and the respective contact surfaces are substantially flat, and

wherein one heat dissipation sheet, which is harder, is made thick in a center and is made thin in a periphery in a thickness direction such that the bonding surface thereof forms a mountain shape in a cross-sectional view, and the other heat dissipation sheet, which is softer, is made thin in a center and is made thick in a periphery in a thickness direction such that the bonding surface thereof forms a reverse mountain shape in a cross-sectional view.

3. The heat dissipation structure of the electronic device according to claim 1,

wherein the first heat dissipation sheet has a chip contact surface with which the IC chip comes in contact and a bonding surface on which the second heat dissipation sheet is bonded, the second heat dissipation sheet has a bonding surface on which the first heat dissipation sheet is bonded and a cover contact surface with which the cover member comes in contact, and the respective contact surfaces are substantially flat, and

wherein a recess in a size that substantially coincides with that of the IC chip having the heat dissipation sheet placed thereon is made in a center of the contact surface of one heat dissipation sheet, which is harder, and a hollow in a size corresponding to that of the IC chip is made in a center of a contact portion where the first heat dissipation sheet comes in contact with the second heat dissipation sheet.

4. The heat dissipation structure of the electronic device according to claim 1,

wherein the first heat dissipation sheet has a chip contact surface with which the IC chip comes in contact and a bonding surface on which the second heat dissipation sheet is bonded, the second heat dissipation sheet has a bonding surface on which the first heat dissipation sheet is bonded and a cover contact surface with which the cover member comes in contact, and the respective contact surfaces are substantially flat, and

wherein a recess in a size that substantially coincides with that of the IC chip having the heat dissipation sheet placed thereon is made in a center of the contact surface of the softer heat dissipation sheet.

5. The heat dissipation structure of the electronic device according to claim 1, wherein a chip pressing member is provided on the cover member, and the chip pressing member presses each of the first and second heat dissipation sheets on the IC chip.

6. The heat dissipation structure of the electronic device according to claim 5, wherein the chip pressing member is an elastic pressing member provided with an elastic piece portion that is fixed to the cover member on one end and that is elastically moveable in a direction toward or away from the cover member, and a contact piece portion that is connected to the other end of the elastic piece portion and that makes contact with the IC chip.

7. The heat dissipation structure of the electronic device according to claim 5, wherein a base member having a substrate support leg that supports the substrate is provided on a rear surface of the substrate, a substrate support member that supports the substrate by sandwiching the substrate with the substrate support leg is provided on the cover member, and a middle portion support leg that supports a middle portion between a plurality of said chip pressing members is provided on the base member.

8. The heat dissipation structure of the electronic device according to claim 1, wherein the first heat dissipation sheet has a different hue from that of the second heat dissipation sheet.

9. The heat dissipation structure of the electronic device according to claim 2, wherein a top surface of the second heat dissipation sheet, which corresponds to the cover contact surface, has a periphery thereof cut in a tapered shape.

10. The heat dissipation structure of the electronic device according to claim 2, wherein a top surface of the second heat dissipation sheet, which corresponds to the cover contact surface, has a periphery thereof rounded in a circular arc shape.

11. The heat dissipation structure of the electronic device according to claim 2, wherein the first heat dissipation sheet has a plurality of grooves on the bonding surface, and the plate-like second heat dissipation sheet is overlaid thereon.

12. The heat dissipation structure of the electronic device according to claim 11, wherein the grooves are rectangular.

13. The heat dissipation structure of the electronic device according to claim 2, wherein the first heat dissipation sheet is formed of a plurality of strip-like narrow sheets that are arranged to have a prescribed distance between each other, and the second heat dissipation sheet, which has a width wider than that of the first heat dissipation sheet, is overlaid on the first heat dissipation sheet.

14. The heat dissipation structure of the electronic device according to claim 2, wherein, in the first heat dissipation sheet, the chip contact surface has a plurality of mountain-shaped protrusions that make the chip contact surface have a wave shape, and the second heat dissipation sheet, which has a wave-shaped contact surface that engages the wave shape of the first heat dissipation sheet, is overlaid on the first heat dissipation sheet.