Multi-Layer Wire Structure for High Efficiency Wireless Communication
First Claim
Patent Images
1. A structure comprising:
- a plurality of conductor layers;
an insulator layer separating each of the conductor layers; and
wherein an electrical resistance is reducible when an electrical signal is propagated through the conductor layers at a frequency.
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Abstract
A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
73 Citations
47 Claims
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1. A structure comprising:
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a plurality of conductor layers; an insulator layer separating each of the conductor layers; and wherein an electrical resistance is reducible when an electrical signal is propagated through the conductor layers at a frequency. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 21, 22)
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19. The structure of claim 19 wherein the electrically conductive material comprises at least one of copper, titanium, platinum and platinum/iridium alloys, tantalum, niobium, zirconium, hathium, nitinol, Co—
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Ni alloys, stainless steel, gold, a gold alloy, palladium, carbon, silver, a noble metal, and a biocompatible material.
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23. A wire structure comprising:
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a plurality of conductors, each conductor having a conductor length, a conductor height, a conductor depth and a conductor surface having a skin depth; and a plurality of insulators positioned between each of the plurality of conductors such that each of the insulators is positioned between adjacent conductors of the plurality of conductors; wherein the wire structure is formed to be capable of propagating an electrical signal through the skin depth of the conductor surface. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47)
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Specification