RFID Tag Structure Having Anti-Reuse Function and Manufacture Method Thereof

• US 20130068842A1
• Filed: 08/27/2012
• Published: 03/21/2013
• Est. Priority Date: 09/16/2011
• Status: Active Grant

• Current Assignee: Favite, Inc.
• Original Assignee: Favite, Inc.
• Inventors: KUO, Chia-Ming, LEE, Cheng-Han
• Granted Patent: US 9,152,910 B2
• Time in Patent Office: Days
• US Class Current: 235/488
• CPC Class Codes: G06K 19/0739 the incapacitated circuit being part of an antenna
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/0776 the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
• CPC Class Codes: G06K 19/07798 part of the antenna or the integrated circuit being adapted for rupturing or breaking, e.g. record carriers functioning as sealing devices for detecting not-authenticated opening of containers electronic seals G09F3/03

Abstract

The present invention provides a RFID tag structure having anti-reuse function, comprising a substrate; a pattern formed on a surface of the substrate; and an adhesive layer provided on a surface of the pattern which is not in contact with the substrate, wherein the adhesive forces of the adhesive layer are stronger than the binding strengths generated between the pattern and the substrate, and the adhesive layer is capable of being adhered on an article to be adhered and a RFID tag is formed thereby; when the RFID tag is separated from the article to be adhered, the substrate is released from the article to be adhered, the pattern and the adhesive layer are still remained on the article to be adhered, thereby preventing the RFID tag from being reused and fulfilling the objective of anti-reuse and anti-counterfeit. The present invention also provides a manufacture method thereof.

Claims

1. A RFID tag structure having anti-reuse function, comprising:

a substrate;

a pattern formed on a surface of said substrate; and

an adhesive layer provided on a surface of said pattern which is not in contact with said substrate, wherein the adhesive forces of said adhesive layer are stronger than the binding strengths generated between said pattern and said substrate, and said adhesive layer is capable of being adhered on an article to be adhered and a RFID tag is formed thereby;

when said RFID tag is separated from said article to be adhered, said substrate is released from said article to be adhered, and said pattern and said adhesive layer are still remained on said article to be adhered, thereby preventing said RFID tag from being reused.

2. The RFID tag structure having anti-reuse function as claimed in claim 1, wherein said substrate is a PET, PI, PVC film, or a composite of the PET, PI, PVC film and a sticker;

said pattern is a RFID antenna pattern.

3. The RFID tag structure having anti-reuse function as claimed in claim 1, wherein said pattern is formed by printing the adopted ink containing catalyst on said substrate, then immersing said substrate on which said ink printed in a solution containing metallic ions to cause said metal to be deposited on said ink printed on said substrate, wherein said ink is epoxy, said solution is CuCl₂, CuSO₄, NiCl₂ or NiSO₄ solution, and said metal is gold, silver, copper, aluminum or nickel.

4. The RFID tag structure having anti-reuse function as claimed in claim 1, wherein said adhesive layer is dry adhesive or flexible adhesive, wherein said dry adhesive is superglue, thermosol, AB adhesive or instant adhesive, said flexible adhesive is rubber based adhesive or acrylic based adhesive.

5. The RFID tag structure having anti-reuse function as claimed in claim 1, wherein said article to be adhered is glass, steel plate, tile, acrylic plate, plastic plate or plastic film.

6. A manufacture method of RFID tag structure having anti-reuse function, including steps of:

printing adopted ink containing catalyst on a substrate thereby forming a pattern;

drying or baking said ink to cause said ink to react with said substrate and the binding strengths being generated thereby;

immersing said substrate on which said ink printed in a solution containing metallic ions to cause said metal to be deposited on said ink and said pattern equipped with electric conductive function being formed on said substrate thereby; and

thereafter, applying an adhesive layer having the adhesive forces on said pattern, wherein said adhesive forces are stronger than said binding strengths.

7. The manufacture method of RFID tag structure having anti-reuse function as claimed in claim 6, wherein said substrate is a PET, PI, PVC film, or a composite of the PET, PI, PVC film and a sticker.

8. The manufacture method of RFID tag structure having anti-reuse function as claimed in claim 6, wherein said pattern is a RFID antenna pattern, said ink is epoxy.

9. The manufacture method of RFID tag structure having anti-reuse function as claimed in claim 6, wherein said solution is CuCl₂, CuSO₄, NiCl₂ or NiSO₄ solution, and said metal is gold, silver, copper, aluminum or nickel.

10. The manufacture method of RFID tag structure having anti-reuse function as claimed in claim 6, wherein said adhesive layer is dry adhesive or flexible adhesive, wherein said dry adhesive is superglue, thermosol, AB adhesive or instant adhesive, said flexible adhesive is rubber based adhesive or acrylic based adhesive.