LEAD FRAME, WIRING BOARD, LIGHT EMITTING UNIT, AND ILLUMINATING APPARATUS
3 Assignments
0 Petitions
Accused Products
Abstract
Provided is lead frame in which a wiring pattern supported by a support piece inside of a one-pitch outer frame section comprises a plurality of base units, each of which comprises a die pad on which a solid-state light emitting element is mounted, a heat sink extending from die pad so as to surround die pad electrically connected to one electrode of the element, and a lead electrically connected to the other electrode of the element. Lead of one base unit among adjacent base units and heat sink of the other base unit are coupled and electrically connected in series. Increase in temperature of the element is inhibited, light output is increased, and cost of a light emitting unit in which a plurality of solid-state light emitting elements connected in series are used is reduced. Also provided are wiring board, light emitting unit, and illuminating apparatus.
59 Citations
31 Claims
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1-15. -15. (canceled)
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16. A light emitting unit comprising:
- a mounting substrate; and
a plurality of solid-state light emitting elements disposed on one surface side of the mounting substrate,wherein the mounting substrate is provided with a heat transfer plate which is formed of a first metal plate and in which the solid-state light emitting elements are mounted on one surface side of the heat transfer plate, a wiring pattern which is formed of a second metal plate and disposed on the other surface side of the heat transfer plate and to which the solid-state light emitting elements are electrically connected, and an insulating layer interposed between the heat transfer plate and the wiring pattern. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25)
- a mounting substrate; and
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26. A light emitting unit comprising:
- a pair of heat transfer plates formed of a first metal plate and disposed at a distance from each other in a thickness direction;
solid-state light emitting elements mounted on one surface sides of the pair of heat transfer plates, being on the side opposite to surface sides of the pair of heat transfer plates that face each other;
a wiring pattern which is formed of a second metal plate and disposed between the pair of heat transfer plates and to which the solid-state light emitting elements are electrically connected; and
a pair of insulating layers, each of which is interposed between the wiring pattern and each of the pair of heat transfer plates. - View Dependent Claims (27, 28, 29, 30, 31)
- a pair of heat transfer plates formed of a first metal plate and disposed at a distance from each other in a thickness direction;
Specification