POLYMERIZABLE COMPOSITION

• US 20130072615A1
• Filed: 11/19/2012
• Published: 03/21/2013
• Est. Priority Date: 05/19/2010
• Status: Active Grant

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Inventors: SHIMADA, Kazuto, MURO, Naotsugu, IKEDA, Kimi, ARIOKA, Daisuke
• Granted Patent: US 8,735,483 B2
• Time in Patent Office: Days
• US Class Current: 524/406
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: C08L 35/02 Homopolymers or copolymers of esters C08L35/06, C08L35/08 take precedence
• CPC Class Codes: G03F 7/0002 Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
• CPC Class Codes: G03F 7/0043 Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof G03F7/0044 takes precedence
• CPC Class Codes: G03F 7/0047 characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
• CPC Class Codes: G03F 7/031 Organic compounds not covered by group G03F7/029
• CPC Class Codes: G03F 7/033 the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
• CPC Class Codes: G03F 7/035 the binders being polyurethanes
• CPC Class Codes: G03F 7/0388 with ethylenic or acetylenic bands in the side chains of the photopolymer
• CPC Class Codes: G03F 7/0755 Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds G03F7/0752 takes precedence

Abstract

A polymerizable composition includes: a polymerization initiator; a polymerizable compound; a tungsten compound; and an alkali-soluble binder.

Claims

1. A polymerizable composition, comprising:

a polymerization initiator;

a polymerizable compound;

a tungsten compound; and

an alkali-soluble binder.

2. The polymerizable composition according to claim 1,

wherein the alkali-soluble binder has an acid group.

3. The polymerizable composition according to claim 1,

wherein the alkali-soluble binder has a crosslinking group.

4. The polymerizable composition according to claim 1,

wherein the alkali-soluble binder is a (meth)acrylic resin or a urethane-based resin.

5. The polymerizable composition according to claim 4,

wherein the alkali-soluble binder is a urethane-based resin.

6. The polymerizable composition according to claim 4,

wherein the alkali-soluble binder is a (meth)acrylic resin.

7. The polymerizable composition according to claim 1,

wherein the tungsten compound is represented by the following formula (I):

M_xW_yO_z 

 

(I)

wherein M represents a metal;

W represents tungsten;

O represents oxygen;

0.001≦

x/y≦

1.1; and

2.2≦

z/y≦

3.0.

8. The polymerizable composition according to claim 7,

wherein M is an alkali metal.

9. The polymerizable composition according to claim 1,

wherein the polymerizable compound is a polyfunctional polymerizable compound having a plurality of polymerizable groups within a molecule.

10. The polymerizable composition according to claim 1,

wherein the polymerization initiator is an acetophenone-based compound.

11. The polymerizable composition according to claim 1, further comprising:

at least two kinds of fillers having different volume average particle diameters of primary particles.

12. The polymerizable composition according to claim 1, further comprising:

a silane coupling agent.

13. The polymerizable composition according to claim 1, which is used for a solder resist.

14. The polymerizable composition according to claim 13, which has a solid content concentration of from 30 to 80 mass % and a viscosity at 25°

C. of from 10 to 3,000 mPa·

s.