Illumination-Source Shape Definition in Optical Lithography

• US 20130074017A1
• Filed: 09/14/2012
• Published: 03/21/2013
• Est. Priority Date: 09/16/2011
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV), IMEC International, Sony Corporation (Sony Group Corp.)
• Original Assignee: ASML Netherlands BV (ASML Holding NV), IMEC International, Sony Corporation (Sony Group Corp.)
• Inventors: Iwase, Kazuya, De Bisschop, Peter
• Granted Patent: US 8,572,522 B2
• Time in Patent Office: Days
• US Class Current: 716/52
• CPC Class Codes: G03F 1/36 Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
• CPC Class Codes: G03F 7/70125 Use of illumination settings tailored to particular mask patterns details of setting means G03F7/70091
• CPC Class Codes: G03F 7/70425 Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
• CPC Class Codes: G03F 7/70433 Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
• CPC Class Codes: G03F 7/70441 Optical proximity correction [OPC]

Abstract

A method and system are described for determining lithographic processing conditions for a lithographic process. After obtaining input, a first optimization is made for illumination source and mask design under conditions of allowing non-rectangular sub-resolution assist features. Thereafter, mask design is optimized in one or more further optimizations for which only rectangular sub-resolution assist features are allowed. The latter results in good lithographic processing while limiting the complexity of the mask design.

Claims

1. A method for determining lithographic processing conditions for a lithographic process, the method comprising:

obtaining characteristics of an illumination source and a mask design, the mask design comprising a lithography pattern;

performing a first optimization for combined optimizing of at least the illumination source characteristics and the mask design characteristics for the lithographic process, whereby for the first optimization non-rectangular sub-resolution assist features for the mask are allowed;

determining from the first optimization a set of optimized illumination source characteristics;

performing at least one additional optimization for optimizing the mask design characteristics of the lithographic process, whereby for the at least one additional optimization the presence of non-rectangular sub-resolution assist features for the mask design is substantially excluded and whereby the at least one additional optimization takes into account the set of optimized illumination source characteristics; and

determining from the at least one additional optimization a set of optimized mask design characteristics substantially excluding non-rectangular sub-resolution assist features.

2. A method according to claim 1, wherein performing the at least one additional optimization comprises taking into account mask rule check settings expressing at least that the most complex mask design feature allowed in the one or more further optimizations is less complex than the most complex mask design feature allowed in the first optimization.

3. A method according to claim 1, wherein the first optimization is performed on an optimization clip, being only a part of the mask design.

4. A method according to claim 1, wherein performing the at least one additional optimization comprises optimizing a threshold for the lithographic processing.

5. A method according to claim 4, wherein the at least one additional optimization comprises:

a second optimization for optimizing a threshold and the mask design characteristics of the lithographic process, whereby for the second optimization the presence of non-rectangular sub-resolution assist features for the mask is substantially excluded and whereby the second optimization takes into account the set of optimized illumination source characteristics; and

a third optimization for optimizing the mask design characteristics for the lithographic process, whereby for the third optimization the presence of non-rectangular sub-resolution assist features for the mask is substantially excluded and whereby the third optimization takes into account the set of optimized illumination source characteristics determined from the first optimization and an optimized threshold determined from the second optimization.

6. A method according to claim 5, wherein performing the second optimization is applied for an optimization clip, being only a part of the mask design.

7. A method according to claim 5, wherein performing the third optimization is applied for the full mask design.

8. A method according to claim 1, wherein the lithographic process comprises multiple patterning steps for patterning different portions of a pattern to be processed.

9. A method according to claim 1, wherein for the first optimization a source-mask optimization algorithm is used based on any of a full resist model or an aerial image model.

10. A method according to claim 1, wherein for the at least one additional optimization a source-mask optimization algorithm is used based on any of a full resist model or an aerial image model.

11. A system for determining lithographic processing conditions for a lithographic process, the system comprising:

an input means for obtaining characteristics of an illumination source and a mask design, the mask design comprising a lithography pattern;

a processing means programmed for performing a first optimization for combined optimizing of the illumination source characteristics and the mask design characteristics for the lithographic process, whereby for the first optimization non-rectangular sub-resolution assist features for the mask are allowed;

determining from the first optimization a set of optimized illumination source characteristics;

performing at least one additional optimization for optimizing the mask design characteristics of the lithographic process, whereby for the at least one additional optimization the presence of non-rectangular sub-resolution assist features for the mask is substantially excluded and whereby the at least one additional optimization takes into account the set of optimized illumination source characteristics; and

determining from the at least one additional optimization a set of optimized mask design characteristics substantially excluding non-rectangular sub-resolution assist features.

12. A method of manufacturing an electronic device, the method comprising:

determining a set of lithographic processing conditions comprising illumination source characteristics and mask characteristics by;

obtaining characteristics of an illumination source and a mask design, the mask design comprising a lithography pattern;

performing a first optimization for combined optimizing of at least the illumination source characteristics and the mask design characteristics for the lithographic process, whereby for the first optimization non-rectangular sub-resolution assist features for the mask are allowed;

determining from the first optimization a set of optimized illumination source characteristics;

performing at least one additional optimization for optimizing the mask design characteristics of the lithographic process, whereby for the at least one additional optimization the presence of non-rectangular sub-resolution assist features for the mask design is substantially excluded and whereby the at least one additional optimization takes into account the set of optimized illumination source characteristics;

determining from the at least one additional optimization a set of optimized mask design characteristics substantially excluding non-rectangular sub-resolution assist features; and

exposing a photoresist layer on a semiconductor substrate using the lithographic processing conditions for forming the electronic device.