Overmolded Dual In-Line Memory Module Cooling Structure

• US 20130074339A1
• Filed: 09/28/2011
• Published: 03/28/2013
• Est. Priority Date: 09/28/2011
• Status: Active Grant

• Current Assignee: Lenovo International Limited (Lenovo Group Ltd.)
• Original Assignee: International Business Machines Corporation
• Inventors: Boraas, Michael A., Kamath, Vinod, Miller, Michael S., Steinke, Mark E., Wakil, Jamil A.
• Granted Patent: US 8,900,503 B2
• Time in Patent Office: Days
• US Class Current: 29/890.03
• CPC Class Codes: B23P 15/26 heat exchangers or the like making heat exchangers by methods covered by other subclasses B21D53/02
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making
• CPC Class Codes: Y10T 29/53113 Heat exchanger

Abstract

Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.

Claims

1. A method of forming an overmolded dual in-line memory module (DIMM) cooling structure, the method comprising:

providing, by a molding system, a mold for a DIMM, the DIMM including a portion with attached memory chips; and

forming, by the molding system, a thermal interface that includes thermal material, the thermal material surrounding at least the portion of the DIMM with the attached memory chips, the thermal interface to transfer heat from the DIMM to a cooling manifold.

2. The method of claim 1 wherein forming the thermal interface includes coupling, by the molding system, a conductive plate to the thermal material, the conductive plate to couple to the cooling manifold.

3. The method of claim 1 wherein forming the thermal interface includes incorporating, by the molding system, a conductive plate into the thermal material.

4. The method of claim 1 wherein forming the thermal interface includes injecting the thermal material into a mold surrounding at least the portion of the DIMM with the attached memory chips.

5. An apparatus forming an overmolded dual in-line memory module (DIMM) cooling structure, the apparatus comprising:

a DIMM that includes a portion with attached memory chips; and

a thermal interface to couple the DIMM to a cooling manifold with a liquid cooled pipe, the thermal interface including thermal material surrounding at least the portion of the DIMM with the attached memory chips, the thermal interface to transfer heat from the DIMM to the cooling manifold.

6. The apparatus of claim 5, wherein the thermal interface includes a conductive plate coupled to the thermal interface, the conductive plate to couple to the cooling manifold, the conductive plate to transfer heat from the thermal material to the cooling manifold.

7. The apparatus of claim 5, wherein the thermal interface includes a conductive plate incorporated into the thermal material, the conductive plate to transfer within the thermal material, heat generated by the DIMM.

8. A method of forming an overmolded dual in-line memory module (DIMM) cooling structure, the method comprising:

forming, by the molding system, a thermal interface to contact and surround at least a portion of a DIMM having memory chips attached;

the thermal interface to couple with a cooling manifold that includes a liquid cooled pipe, the thermal interface including thermal material to transfer heat from the DIMM to the cooling manifold.

9. The method of claim 8 further comprising forming, by the molding system, a manifold engagement surface on the thermal interface, the manifold engagement surface to lock the thermal interface to the cooling manifold.

10. The method of claim 9 wherein the manifold engagement surface locks with the cooling manifold when the thermal interface is stretched.

11. The method of claim 8 wherein when the thermal interface is stretched, the thermal material compresses around the memory chips attached to the DIMM.

12. The method of claim 8 wherein forming the thermal interface includes injecting the thermal material into a mold.

13. An apparatus forming an overmolded dual in-line memory module (DIMM) cooling structure, the apparatus comprising:

a cooling manifold that includes a liquid cooled pipe; and

a thermal interface to contact and surround at least a portion of a DIMM having memory chips attached and to contact the cooling manifold, the thermal interface including thermal material, the thermal material to transfer heat from the DIMM to the cooling manifold.

14. The apparatus of claim 13 wherein the thermal interface includes a manifold engagement surface to lock the thermal interface to the cooling manifold.

15. The apparatus of claim 14 wherein the manifold engagement surface locks with the cooling manifold when the thermal interface is stretched.

16. The apparatus of claim 13 wherein when the thermal interface is stretched, the thermal material compresses around the memory chips attached to the DIMM.

17. The apparatus of claim 13 wherein the thermal interface is formed by injecting the thermal material into a mold.