Lateral PNP Bipolar Transistor with Narrow Trench Emitter
First Claim
1. A lateral bipolar transistor, comprising:
- a semiconductor substrate of a first conductivity type;
an epitaxial layer of a second conductivity type formed on the substrate, the second conductivity type being opposite the first conductivity type;
a first buried layer of the first conductivity type and a second buried layer of the second conductivity type both formed between the substrate and the epitaxial layer, the first buried layer being located under a trench isolation structure and the second buried layer being located under a base region;
a dielectric layer formed over the epitaxial layer;
first and second trenches formed in the dielectric layer and the epitaxial layer, the trenches being filled with at least one polysilicon layer, the polysilicon layer being insulated from at least a bottom portion of each trench by a dielectric layer, and the polysilicon layer being doped with dopants of the first conductivity type; and
first and second diffusion regions of the first conductivity type formed in the epitaxial layer surrounding sidewalls of respective first and second trenches, the polysilicon layer of each trench being in electrical contact with the respective diffusion region surrounding sidewalls of the respective trench,wherein an emitter region is formed in the first trench and the first diffusion region, a collector region is formed in the second trench and the second diffusion region, the base region being formed in the epitaxial layer between the first and second diffusion regions associated with the first and second trenches, the polysilicon layer in the first trench being formed over the dielectric layer and extending over a portion of the base region, the extended portion of the polysilicon layer of the first trench functioning as a field plate for the base region.
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Abstract
A lateral bipolar transistor includes trench emitter and trench collector regions to form ultra-narrow emitter regions, thereby improving emitter efficiency. The same trench process is used to form the emitter/collector trenches as well as the trench isolation structures so that no additional processing steps are needed to form the trench emitter and collector. In embodiments of the present invention, the trench emitter and trench collector regions may be formed using ion implantation into trenches formed in a semiconductor layer. In other embodiments, the trench emitter and trench collector regions may be formed by out-diffusion of dopants from heavily doped polysilicon filled trenches.
226 Citations
36 Claims
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1. A lateral bipolar transistor, comprising:
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a semiconductor substrate of a first conductivity type; an epitaxial layer of a second conductivity type formed on the substrate, the second conductivity type being opposite the first conductivity type; a first buried layer of the first conductivity type and a second buried layer of the second conductivity type both formed between the substrate and the epitaxial layer, the first buried layer being located under a trench isolation structure and the second buried layer being located under a base region; a dielectric layer formed over the epitaxial layer; first and second trenches formed in the dielectric layer and the epitaxial layer, the trenches being filled with at least one polysilicon layer, the polysilicon layer being insulated from at least a bottom portion of each trench by a dielectric layer, and the polysilicon layer being doped with dopants of the first conductivity type; and first and second diffusion regions of the first conductivity type formed in the epitaxial layer surrounding sidewalls of respective first and second trenches, the polysilicon layer of each trench being in electrical contact with the respective diffusion region surrounding sidewalls of the respective trench, wherein an emitter region is formed in the first trench and the first diffusion region, a collector region is formed in the second trench and the second diffusion region, the base region being formed in the epitaxial layer between the first and second diffusion regions associated with the first and second trenches, the polysilicon layer in the first trench being formed over the dielectric layer and extending over a portion of the base region, the extended portion of the polysilicon layer of the first trench functioning as a field plate for the base region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method for fabricating a lateral bipolar transistor, comprising:
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providing a semiconductor substrate of a first conductivity type; forming a first buried layer of the first conductivity type and a second buried layer of a second conductivity type in the substrate, the second conductivity type being opposite the first conductivity type, the first buried layer being located under a trench isolation structure and the second buried layer being located under a base region; forming an epitaxial layer of the second conductivity type on the substrate; forming a dielectric layer over the epitaxial layer; forming first and second trenches in the dielectric layer and the epitaxial layer; forming first and second diffusion regions of the first conductivity type in the epitaxial layer surrounding sidewalls of respective first and second trenches; forming a lining oxide layer and a first polysilicon layer in a lower portion of each trench, the first polysilicon layer being insulated from the sidewalls of the trenches by the lining oxide layer; forming a second polysilicon layer at an upper portion of each trench, the second polysilicon layer being heavily doped with the first conductivity type and the second polysilicon layer of each trench being in electrical contact with the respective diffusion region surrounding sidewalls of the respective trench; and forming an extended portion of the second polysilicon layer of the first trench over the dielectric layer and extending over a portion of the base region, the extended portion of the second polysilicon layer of the first trench functioning as a field plate for the base region, wherein an emitter region is formed in the first trench and the first diffusion region, a collector region is formed in the second trench and the second diffusion region, the base region being formed in the epitaxial layer between the first and second diffusion regions associated with the first and second trenches. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A method for fabricating a lateral bipolar transistor, comprising:
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providing a semiconductor substrate of a first conductivity type; forming a first buried layer of the first conductivity type and a second buried layer of a second conductivity type in the substrate, the second conductivity type being opposite the first conductivity type, the first buried layer being located under a trench isolation structure and the second buried layer being located under a base region; forming an epitaxial layer of the second conductivity type on the substrate; forming a dielectric masking layer over the epitaxial layer; forming first and second trenches in the dielectric masking layer and the epitaxial layer; removing the dielectric masking layer; forming a second dielectric layer over the epitaxial layer and in the first and second trenches; isotropically etching the second dielectric layer to leave the second dielectric layer on a top surface of the epitaxial layer and on a bottom portion of each trench; forming a polysilicon layer over the second dielectric layer and in each trench, the polysilicon layer being heavily doped with the first conductivity type; patterning the polysilicon layer to form polysilicon regions associated with each trench and to form an extended portion of the polysilicon layer of the first trench over the second dielectric layer and extending over a portion of the base region, the extended portion of the polysilicon layer of the first trench functioning as a field plate for the base region; and annealing the epitaxial layer and the polysilicon layer to form by dopant out-diffusion first and second diffusion regions of the first conductivity type in the epitaxial layer surrounding sidewalls of respective first and second trenches, the polysilicon layer of each trench being in electrical contact with the respective diffusion region surrounding sidewalls of the respective trench, wherein an emitter region is formed in the first trench and the first diffusion region, a collector region is formed in the second trench and the second diffusion region, the base region being formed in the epitaxial layer between the first and second diffusion regions associated with the first and second trenches. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36)
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Specification