INTEGRATED CIRCUIT AND METHOD OF MAKING

• US 20130075894A1
• Filed: 07/31/2012
• Published: 03/28/2013
• Est. Priority Date: 09/23/2011
• Status: Abandoned Application

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Gallegos, Bernardo, Castro, Abram
• Application Number:
  US13/563,345
• Publication Number:
  US 20130075894A1
• Time in Patent Office: Days
• US Class Current: 257/737
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/76801 characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
• CPC Class Codes: H01L 21/76838 characterised by the formation and the after-treatment of the conductors etching for patterning the conductors H01L21/3213
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/13082 Two-layer arrangements
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13347 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81815 Reflow soldering
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/9202 Forming additional connectors after the connecting process
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/20 : Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA

Abstract

Integrated circuits and methods of fabricating integrated circuits are disclosed herein. One embodiment of an integrated circuit includes a die having a side, wherein a conductive stud extends from the side. A dielectric layer having a first side and a second side is located proximate the side of the die so that the first side of the dielectric layer is adjacent the side of the die. The conductive stud extends into the first side of the dielectric layer. A conductive layer having a first side and a second side is located adjacent the second side of the dielectric layer, wherein the first side of the conductive layer is located adjacent the second side of the dielectric layer. A conductive adhesive connects the conductive stud to the first side of the conductive layer.

Claims

1. A circuit comprising:

a die having a side;

a conductive stud having a first end and an opposite second end, wherein the first end is connected to the side of the die and wherein the conductive stud extends from the side;

a first dielectric layer having a first side and a second side, wherein the first side of the first dielectric layer is located proximate the side of the die so that the conductive stud extends into the first dielectric layer from the first side;

a conductive layer having a first side and a second side, wherein the first side is located adjacent the second side of the first dielectric layer and proximate the second end of the conductive stud; and

a conductive adhesive adhered to the second side of the conductive stud and the first side of the conductive layer.

2. The circuit of claim 1, wherein said first dielectric layer is adhered to the side of said die.

3. The circuit of claim 1, and further comprising a connection mechanism electrically connected to at least a portion of the second side of the conductive layer.

4. The circuit of claim 1, wherein at least a portion of the die is encapsulated with an encapsulant.

5. The circuit of claim 4, wherein at least a portion of the first dielectric layer contacts the encapsulant.

6. The circuit of claim 1 and further comprising a second dielectric layer having a first side and a second side, wherein the first side is located adjacent the second side of the conductive layer, wherein the second dielectric layer has a via extending between the first side and the second side, and wherein the via is electrically connected to the second side of the conductive layer.

7. The circuit of claim 6, and further comprising a connection mechanism electrically connected to the via.

8. The circuit of claim 1, wherein the conductive adhesive is solder.

9. The circuit of claim 1, wherein the conductive stud comprises copper.

10. The circuit of claim 1, wherein the side of the die comprises a pad and wherein the conductive stud is connected to the pad.

17. The method of claim 1 and further comprising affixing a connection mechanism to the second side of the second dielectric layer, the connection mechanism being electrically connected to the second via.

11. A method of fabricating a circuit, the method comprising:

providing a die, the die having a side;

connecting a conductive stud to the side of the die, wherein the conductive stud has a first end that is connected to the die and an opposite second end;

affixing a first dielectric layer to the side of the die, the first dielectric layer having a first side and a second side, wherein the first side of the first dielectric layer is affixed to the side of the die, and wherein the conductive stud enters the first side of the first dielectric layer; and

affixing a conductive layer to the second side of the first dielectric layer; and

adhering the second side of the conductive stud to the conductive layer using a conductive adhesive.

12. The method of claim 11 and further comprising encapsulating said die prior to said affixing said first dielectric layer to said side of said die wherein said encapsulating comprises substantially encapsulating said die, except for said side.

13. The method of claim 11, wherein said first dielectric layer is affixed to said die in an uncured state and further comprising:

applying an uncured encapsulant to said die; and

curing said encapsulant and said first dielectric layer simultaneously.

14. The method of claim 13, wherein the conductive adhesive is cured simultaneously with the encapsulant and the first dielectric layer.

15. The method of claim 14, wherein the conductive adhesive is solder.

16. The method of claim 11 and further comprising:

affixing a second dielectric layer to the conductive layer, the second dielectric layer having a first side and a second side, wherein the first side of the second dielectric layer is located adjacent the conductive layer; and

forming a second via between the conductive layer and the second side of the second dielectric layer.

18. The method of claim 11, wherein said affixing a first dielectric layer comprises affixing a first dielectric material to the conductive layer and applying the dielectric material with the conductive layer to the side of said die.

19. The method of claim 11, and further comprising applying a conductive adhesive to the second side of the conductive stud and wherein the adhering comprises adhering the second side of the conductive stud to the conductive layer using the conductive adhesive.

20. A circuit comprising:

a die having a side;

an encapsulant encapsulating at least a portion of the die other than the side;

a conductive stud having a first end and an opposite second end, wherein the first end is connected to the side of the die and wherein the conductive stud extends from the side;

a first dielectric layer having a first side and a second side, wherein the first side of the first dielectric layer is located proximate the side of the die so that the conductive stud extends into the first dielectric layer from the first side and wherein the first dielectric layer is adhered to at least a portion of the encapsulant; and

a conductive layer having a first side and a second side, wherein the first side is located adjacent the second side of the first dielectric layer and proximate the second end of the conductive stud;

a conductive adhesive adhered to the second side of the conductive stud and the first side of the conductive layer;

a second dielectric layer adhered to the second side of the conductive layer;

a via extending through the second dielectric layer; and

a connection mechanism attached to the second dielectric layer and electrically connected to the via.