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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A SUBSTRATE EMBEDDED DUMMY-DIE PADDLE AND METHOD OF MANUFACTURE THEREOF

  • US 20130075922A1
  • Filed: 09/23/2011
  • Published: 03/28/2013
  • Est. Priority Date: 09/23/2011
  • Status: Active Grant
First Claim
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1. A method of manufacture of an integrated circuit packaging system comprising:

  • providing a dummy-die paddle having a first inactive side facing up, a second inactive side facing down;

    forming an insulator in a single continuous structure around and in direct contact with the first inactive side; and

    mounting an integrated circuit over the dummy-die paddle and the insulator, the integrated circuit and the dummy-die paddle having the same coefficient of thermal expansion as the dummy-die paddle.

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