ELECTRONIC DEVICE

• US 20130077233A1
• Filed: 09/13/2012
• Published: 03/28/2013
• Est. Priority Date: 09/23/2011
• Status: Active Grant

• Current Assignee: Lenovo (Beijing) Limited (Lenovo Group Ltd.)
• Original Assignee: Lenovo (Beijing) Limited (Lenovo Group Ltd.)
• Inventors: Cao, Weijie, Xi, Shenghua, Fang, Li
• Granted Patent: US 9,502,324 B2
• Time in Patent Office: Days
• US Class Current: 361/679.54
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An electronic device having a heat generating element and a housing is provided including a heat dissipation arrangement provided between the heat generating element and the housing, the heat dissipation arrangement comprising a first layer in contact with the heat generating element and a second layer provided on top of the first layer and being in contact with the housing, the first layer having higher heat conductivity than the second layer, the second layer preventing heat from rapidly passing through such that the heat can be diffused in the first layer.

Claims

1. An electronic device having a heat generating element and a housing, comprising:

a heat dissipation arrangement provided between the heat generating element and the housing, the heat dissipation arrangement comprising a first layer in contact with the heat generating element, and a second layer provided on top of the first layer and being in contact with the housing,

the first layer has a higher heat conductivity than the second layer, and the second layer is for preventing heat from rapidly passing through the second layer such that the heat is diffused within the first layer.

2. The electronic device of claim 1, wherein the area of the first layer is equal to or smaller than the area of the second layer.

3. The electronic device of claim 1, wherein the first layer is made of a heat conductive material, and the second layer is made of a heat insulating material.

4. The electronic device of claim 1, wherein the electronic device comprises a laptop computer, a mobile communication terminal or a tablet computer.

5. An electronic device having a heat generating element and a housing, comprising:

a heat dissipation arrangement provided between the heat generating element and the housing, the heat dissipation arrangement comprising a first layer in contact with the heat generating element, a third layer in contact with the housing and a second layer provided between the first layer and the third layer,

the first layer and the third layer each have a higher heat conductivity than the second layer, and the second layer is for preventing heat from rapidly passing through the second layer such that the heat is diffused within the first layer.

6. The electronic device of claim 5, wherein the area of the first layer is equal to or smaller than the area of the second layer.

7. The electronic device of claim 6, wherein the area of the second layer is equal to or smaller than the area of the third layer.

8. The electronic device of claim 5, wherein the first layer is made of a heat conductive material, and the second layer is made of a heat insulating material.

9. The electronic device of claim 5, wherein the third layer is made of a heat conductive material.

10. The electronic device of claim 5, wherein the electronic device comprises a laptop computer, a mobile communication terminal or a tablet computer.

11. An electronic device having a heat generating element, comprising:

a heat dissipation housing in contact with the heat generating element, the heat dissipation housing comprising an inner layer in contact with the heat generating element, and an outer layer attached to the inner layer,

the inner layer has a higher heat conductivity than the outer layer, and the outer layer is for preventing heat from rapidly passing through the outer layer such that the heat is diffused within the inner layer.

12. The electronic device of claim 11, wherein the inner layer is made of a heat conductive material, and the outer layer is made of a heat insulating material.

13. The electronic device of claim 11, wherein the electronic device comprises a laptop computer, a mobile communication terminal or a tablet computer.

14. An electronic device having a heat generating element, comprising:

a heat dissipation housing in contact with the heat generating element, the heat dissipation housing comprising an inner layer in contact with the heat generating element, an intermediate layer attached to the inner layer, and an outer layer attached to the intermediate layer,

the inner layer and the outer layer each have a higher heat conductivity than the intermediate layer, and the intermediate layer is for preventing heat from rapidly passing through the intermediate layer such that the heat is diffused within the inner layer.

15. The electronic device of claim 14, wherein the inner layer and the outer layer are each made of a heat conductive material, and the intermediate layer is made of a heat insulating material.

16. The electronic device of claim 14, wherein the electronic device comprises a laptop computer, a mobile communication terminal or a tablet computer.