Arrangement of a power semiconductor circuit

• US 20130077244A1
• Filed: 04/04/2012
• Published: 03/28/2013
• Est. Priority Date: 09/23/2011
• Status: Active Grant

• Current Assignee: AEG Power Solutions BV (3W Power Holdings Limited)
• Original Assignee: AEG Power Solutions BV (3W Power Holdings Limited)
• Inventors: Bajan, Liviu, Schulte, Gerrit, EL Gharib, Samir
• Granted Patent: US 8,917,508 B2
• Time in Patent Office: Days
• US Class Current: 361/699
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

The invention relates to a power electronic assembly (1, 2, 3) with a heat sink (2), a power semiconductor module (1) and a circuit arrangement (3) for controlling the power semiconductor module, wherein the heat sink (2) has at least two parallel channels through which a coolant can flow.

Claims

1. A power electronic assembly comprising

a heat sink as a cooling body (2),

a power semiconductor module (1) and

a circuit arrangement (3) for controlling the power semiconductor module,

wherein the cooling body (2) comprises at least two parallel channels for accommodating flowing coolant.

2. The power electronic assembly according to claim 1,

wherein the channels are connected with one another by at least one first connecting channel.

3. The power electronic assembly according to claim 2, wherein a first plurality of first adjacent channels of the channels form supply channels having end regions connected with one another by way of the first connecting channel, and a second plurality of second adjacent channels of the channels form return channels having start regions which are connected with one another via the first connecting channel and which are connected with the end regions of the supply channels.

4. The power electronic assembly according to claim 3, wherein the first plurality and the second plurality are identical.

5. The power electronic assembly according to claim 3, wherein start regions of the supply channels are connected by way of a second connecting channel.

6. The power electronic assembly according to claim 3, wherein the end regions of the return channels are connected by way of third connecting channels.

7. The Power electronic assembly according to claim 2, wherein the channels and/or the connecting channels are formed by sections of through-holes (21, 22) and/or blind holes (23, 24) in a solid body forming the cooling body (2).

8. The power electronic assembly according to claim 7, wherein the sections of the through-holes (21, 22) and/or blind holes (23, 24) are delimited by stoppers (26), screws and the like and by the solid body.

9. The power electronic assembly according to claim 8, wherein the stoppers (26), screws and the like are releasably inserted in the solid body and/or glued.

10. The power electronic assembly according to claim 1, wherein the power semiconductor module (1) is mounted on the heat sink (2).

11. The power electronic assembly according to claim 1, wherein the circuit arrangement (3) for controlling the power semiconductor module (1) comprises a circuit carrier (31) which is mounted on the heat sink (2) with spacers (33) in spaced relationship from a surface of the heat sink (2).

12. The power electronic assembly according to claim 1, wherein the heat sink (2) comprises bores (28) or on a side facing away from the power semiconductor module (1) at least one groove, in which mounting means for mounting the power electronic assembly (1, 2, 3) on a carrier are arranged.

18. The Power electronic assembly according to claim 7, wherein the solid body forming the cooling body (2) is a block or an extruded profile.

13. An arrangement (A) comprising several power electronic assemblies, each power electronic assembly comprising

a heat sink as a cooling body(2),

a power semiconductor module (1) and

a circuit arrangement (3) for controlling the power semiconductor module,

wherein the cooling body (2) comprises at least two parallel channels for accommodating flowing coolant.

14. The arrangement (A) according to claim 13, wherein the arrangement (A) is an inverter or a preferably clocked rectifier.

15. The arrangement (A) according to claim 13, wherein the power electronic assemblies are arranged with respect to one another such that the channels are arranged parallel to one another.

16. The arrangement (A) according to claim 13, wherein the arrangement (A) comprises supply lines and return lines for a coolant which are connected to the supply channels and the return channels, respectively, with fittings provided in start regions of the supply channels and in end regions of the return channels, respectively.

17. The arrangement (A) according to claim 16, wherein the power electronic assemblies are connected in parallel for fluid conduction.