Arrangement of a power semiconductor circuit
First Claim
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1. A power electronic assembly comprisinga heat sink as a cooling body (2),a power semiconductor module (1) anda circuit arrangement (3) for controlling the power semiconductor module,wherein the cooling body (2) comprises at least two parallel channels for accommodating flowing coolant.
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Abstract
The invention relates to a power electronic assembly (1, 2, 3) with a heat sink (2), a power semiconductor module (1) and a circuit arrangement (3) for controlling the power semiconductor module, wherein the heat sink (2) has at least two parallel channels through which a coolant can flow.
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18 Claims
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1. A power electronic assembly comprising
a heat sink as a cooling body (2), a power semiconductor module (1) and a circuit arrangement (3) for controlling the power semiconductor module, wherein the cooling body (2) comprises at least two parallel channels for accommodating flowing coolant.
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13. An arrangement (A) comprising several power electronic assemblies, each power electronic assembly comprising
a heat sink as a cooling body(2), a power semiconductor module (1) and a circuit arrangement (3) for controlling the power semiconductor module, wherein the cooling body (2) comprises at least two parallel channels for accommodating flowing coolant.
Specification