SEMICONDUCTOR CONTROL DEVICE
First Claim
1. A semiconductor control device comprising:
- a plurality of semiconductor modules each having a cooling member and a semiconductor element;
a circuit board mounted with a control element that controls the plurality of semiconductor modules; and
a case in which the plurality of semiconductor modules and the circuit board are respectively mounted,wherein the case is provided with a cylindrical sidewall that forms an internal space within the case, and on both ends of the sidewall, a first opening and a second opening are correspondingly formed to be opposite to each other,wherein the plurality of semiconductor modules include a first semiconductor module mounted on the sidewall on a side of the first opening, and a second semiconductor module mounted on the sidewall on a side of the second opening,and wherein the circuit board is positioned between the first semiconductor module and the second semiconductor module, in the internal space.
2 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor control device is provided with: a plurality of semiconductor modules each having a cooling member and a semiconductor element; a circuit board mounted with a control element that controls the plurality of semiconductor modules; and a case in which the plurality of semiconductor modules and the circuit board are respectively mounted. The case is provided with a cylindrical sidewall that forms an internal space within the case, and on both ends of the sidewall, a first opening and a second opening are correspondingly formed to be opposite to each other. The plurality of semiconductor modules include a first semiconductor module mounted on the sidewall on a side of the first opening, and a second semiconductor module mounted on the sidewall on a side of the second opening. The circuit board is positioned between the first semiconductor module and the second semiconductor module, in the internal space.
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Citations
13 Claims
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1. A semiconductor control device comprising:
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a plurality of semiconductor modules each having a cooling member and a semiconductor element; a circuit board mounted with a control element that controls the plurality of semiconductor modules; and a case in which the plurality of semiconductor modules and the circuit board are respectively mounted, wherein the case is provided with a cylindrical sidewall that forms an internal space within the case, and on both ends of the sidewall, a first opening and a second opening are correspondingly formed to be opposite to each other, wherein the plurality of semiconductor modules include a first semiconductor module mounted on the sidewall on a side of the first opening, and a second semiconductor module mounted on the sidewall on a side of the second opening, and wherein the circuit board is positioned between the first semiconductor module and the second semiconductor module, in the internal space. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification