POWER BOARD, METHOD OF MANUFACTURING THE SAME AND LIQUID CRYSTAL DISPLAY APPARATUS HAVING THE SAME

• US 20130077267A1
• Filed: 04/05/2012
• Published: 03/28/2013
• Est. Priority Date: 09/22/2011
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd. (Samsung Group)
• Original Assignee: Samsung Electronics Co. Ltd. (Samsung Group)
• Inventors: KANG, Jeong-il, CHANG, Gil-yong, CHOI, Shin-wook
• Application Number:
  US13/440,027
• Publication Number:
  US 20130077267A1
• Time in Patent Office: Days
• US Class Current: 361/752
• CPC Class Codes: G02F 1/133308 Support structures for LCD panels, e.g. frames or bezels
• CPC Class Codes: H05K 1/02 Details
• CPC Class Codes: H05K 2201/2036 Permanent spacer or stand-off in a printed circuit or printed circuit assembly pattern for applying drops or paste H05K2203/0545
• CPC Class Codes: H05K 3/34 by soldering
• CPC Class Codes: Y10T 29/49144 by metal fusion

Abstract

A power board is provided. The power board includes a board housing; a board included in an inside of the board housing; a plurality of parts mounted in the board; and a supporting member configured to be mounted in the board and to support the board to prevent each of the plurality of parts from being damaged. The supporting member includes a supporting member mounted by using a surface mounted technology (SMT) process.

Claims

1. A power board, comprising:

a board housing;

a board included in an inside of the board housing;

a plurality of parts mounted in the board; and

a supporting member which is mounted in the board and which supports the board to prevent each of the plurality of parts from being damaged,

wherein the supporting member includes a supporting member mounted by using a surface mounted technology (SMT) process.

2. The power board as claimed in claim 1, wherein the supporting member mounted by using the SMT process is soldered and fixed to the board.

3. The power board as claimed in claim 2, wherein the supporting member includes:

a lower supporting unit which supports a bottom of the board; and

a soldering unit attached to a side of the lower supporting unit and which is soldered and fixed to the bottom of the board.

4. The power board as claimed in claim 2, wherein the supporting member further includes an upper supporting unit which is formed on the lower supporting unit and which supports a top of the board.

5. The power board as claimed in claim 3, wherein a height of the lower supporting unit is greater than a height of each part mounted on the bottom of the board.

6. The power board as claimed in claim 4, wherein the board includes a through-hole which allows the upper supporting unit to be inserted therethrough, and the lower supporting unit has a width greater than a width of the throughhole.

7. The power board as claimed in claim 6, wherein a height of a portion of the upper supporting unit extending from the top of the board is greater than a height of each part mounted on the top of the board.

8. The power board as claimed in claim 6, wherein the supporting member further includes a hook unit which prevents the upper supporting unit from slipping through the through-hole.

9. The power board as claimed in claim 3, wherein the soldering unit is formed such that the soldering unit is mounted to penetrate the lower supporting unit, and both of a first end and a second end opposite the first end of the soldering unit are bent to be in contact with the bottom of the board.

10. The power board as claimed in claim 9, wherein each of a plurality of soldering units is mounted in the lower supporting unit such that each respective soldering unit is spaced apart from a next soldering unit by a predetermined distance.

11. The power board as claimed in claim 3, wherein the soldering unit is formed such that a first end of the soldering unit is inserted into the lower supporting unit and a second end opposite the first end of the soldering unit is in contact with the bottom of the board.

12. The power board as claimed in claim 11, wherein each of a plurality of soldering units is mounted in the lower supporting unit such that each respective soldering unit is spaced apart from a next soldering unit by a predetermined distance.

13. The power board as claimed in claim 2, wherein the supporting member includes an insulator formed by using a thermosetting resin, which includes a material which is heat-resistant at a soldering temperature.

14. A liquid crystal display apparatus comprising the power board according to claim 1.

15. A method of manufacturing a power board, comprising:

mounting an upper part on a top of a board;

mounting a lower part and a supporting member which supports the board to prevent the upper and lower parts from being damaged in a bottom of the board by using a surface mount technology (SMT) process; and

soldering the lower part and the supporting member on the bottom of the board.

16. The method as claimed in claim 15, wherein the supporting member includes:

a lower supporting unit which supports the bottom of the board; and

a soldering unit attached to a side of the lower supporting unit and which is soldered and fixed to the bottom of the board,

wherein a height of the lower supporting unit is greater than a height of each part mounted on the bottom of the board.

17. The method as claimed in claim 16, wherein the supporting member further includes an upper supporting unit which is formed on the lower supporting unit and which supports a top of the board,

wherein a height of a portion of the upper supporting unit extending from the top of the board is greater than a height of each part mounted on the top of the board.

18. The method as claimed in claim 17, further comprising forming a hook unit which prevents the upper supporting unit from slipping through a through-hole.

19. The method as claimed in claim 16, wherein the soldering unit is mounted to penetrate the lower supporting unit and both of a first end and a second end opposite the first end of the soldering unit are bent to be in contact with the bottom of the board.

20. The method as claimed in claim 16, wherein the soldering unit is formed such that a first end of the soldering unit is inserted into the lower supporting unit and a second end opposite the first end of the soldering unit is in contact with the bottom of the board.