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INTEGRATED THERMAL AND EMI SHIELDS AND METHODS FOR MAKING THE SAME

  • US 20130077282A1
  • Filed: 09/07/2012
  • Published: 03/28/2013
  • Est. Priority Date: 09/09/2011
  • Status: Abandoned Application
First Claim
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1. An electronic device, comprising:

  • a circuit board;

    at least one component coupled to the circuit board, the at least one component requiring EMI and thermal shielding;

    a conductive fence disposed on the circuit board and around a periphery of the at least one component; and

    an integrated thermal and EMI shield mated to the conductive fence, the integrated thermal and EMI shield constructed from a silicon material having EMI blocking additives incorporated therein and is at least partially grounded to the circuit board via the shield engagement member.

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