INTEGRATED THERMAL AND EMI SHIELDS AND METHODS FOR MAKING THE SAME

• US 20130077282A1
• Filed: 09/07/2012
• Published: 03/28/2013
• Est. Priority Date: 09/09/2011
• Status: Abandoned Application

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Malek, Shayan, Wittenberg, Michael, Dinh, Richard Hung Minh
• Application Number:
  US13/607,567
• Publication Number:
  US 20130077282A1
• Time in Patent Office: Days
• US Class Current: 361/818
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: H05K 13/04 Mounting of components , e.g. of leadless components
• CPC Class Codes: H05K 9/003 made from non-conductive materials comprising an electro-conductive coating H05K9/0031 takes precedence
• CPC Class Codes: H05K 9/0032 having multiple parts, e.g. frames mating with lids
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

Electronic devices having integrated thermal and EMI shields for providing thermal dissipation and EMI shielding of one or more circuitry components, and methods for making the same, are provided. The integrated shield combines both thermal and EMI shielding properties into a single layer material that saves space within the electronic device. The integrated shield can be constructed from a silicon material having one or more EMI shielding additives incorporated therein.

Claims

1. An electronic device, comprising:

a circuit board;

at least one component coupled to the circuit board, the at least one component requiring EMI and thermal shielding;

a conductive fence disposed on the circuit board and around a periphery of the at least one component; and

an integrated thermal and EMI shield mated to the conductive fence, the integrated thermal and EMI shield constructed from a silicon material having EMI blocking additives incorporated therein and is at least partially grounded to the circuit board via the shield engagement member.

2. The electronic device of claim 1, wherein:

the integrated thermal and EMI shield includes a top surface and a bottom surface, and wherein a portion of the bottom surface interfaces with the at least one component.

3. The electronic device of claim 2, further comprising:

a structure having a first surface that interfaces with the top surface of the integrated thermal and EMI shield.

4. The electronic device of claim 2, wherein substantially no gap exists at the interface between the first and top surfaces.

5. The electronic device of claim 1, wherein:

the at least one component comprises a plurality of sides; and

the integrated thermal and EMI shield is partially grounded to the circuit board along at least two of the plurality of sides.

6. The electronic device of claim 5, wherein:

the integrated thermal and EMI shield is grounded to the circuit board along each of the plurality of sides of the component.

7. The electronic device of claim 1, wherein:

the conductive fence comprises a flangeless fence.

8. The electronic device of claim 1, wherein:

the conductive fence comprises a flanged fence.

9. The electronic device of claim 1, wherein:

the integrated thermal and EMI shield comprises;

silicon and a conductive powder.

10. A method for thermally shielding an electronic device component and for shielding the electronic device component from electromagnetic interference, comprising:

coupling the component to a circuit board; and

mounting a conductive fence to the circuit board, the conductive fence forming a perimeter around the component; and

securing an integrated thermal and EMI shield to the conductive fence such that the integrated shield fits flush against at least a top surface of the component, the integrated thermal and EMI shield constructed from a silicon material having EMI blocking additives incorporated therein and is at least partially grounded to the circuit board via the conductive fence.

11. The method of claim 10, wherein:

mounting the conductive fence comprises soldering the conductive fence to the circuit board.

12. The method of claim 10, wherein the conductive fence comprises a plurality of shield retaining members and the integrated shield comprises a plurality of fence engaging members, and wherein securing the integrated shield to the conductive fence comprises interfacing each of the plurality of fence engaging members to respective ones of the plurality of fence engaging members.

13. The method of claim 10, wherein:

the integrated shield comprises silicon and nickel covered graphite.

14. A method for thermally shielding an electronic device component and for shielding the electronic device component from electromagnetic interference, comprising:

coupling the component to a circuit board; and

securing an integrated thermal and EMI shield to the circuit board such that the integrated shield fits flush against at least a top surface of the component, the integrated thermal and EMI shield constructed from a silicon material having EMI blocking additives incorporated therein, and wherein the integrated shield comprises a metal gasket that surrounds a perimeter of the component and which is soldered to the circuit board to provide a grounding connection for the integrated shield.

15. The method of claim 14, wherein the integrated shield comprises silicon and a conductive filler.

16. An electronic device, comprising:

a circuit board;

at least one component coupled to the circuit board, the at least one component requiring EMI and thermal shielding;

a grounding perimeter disposed on the circuit board and around a periphery of the at least one component; and

an integrated thermal and EMI shield comprising a metal gasket that is mounted to the grounding perimeter, the integrated thermal and EMI shield constructed from a silicon material having EMI blocking additives incorporated therein and is at least partially grounded to the circuit board via the metal gasket.

17. The electronic device of claim 16, wherein the metal gasket is insert molded to the integrated thermal and EMI shield.

18. The electronic device of claim 16, wherein:

the metal gasket is soldered to the grounding perimeter.

19. The electronic device of claim 16, further comprising a structure having a first surface that interfaces with a top surface of the integrated thermal and EMI shield.

20. The electronic device of claim 19, wherein substantially no gap exists at the interface between the first and top surfaces.

21. The electronic device of claim 16, wherein:

the EMI additive is a nickel covered graphite.

22. The electronic device of claim 16, wherein the EMI additive is a conductive powder.