METHOD FOR MANUFACTURING A FLEXIBLE TRANSPARENT 1T1R STORAGE UNIT BASED ON A COMPLETELY LOW-TEMPERATURE PROCESS

• US 20130078761A1
• Filed: 06/20/2012
• Published: 03/28/2013
• Est. Priority Date: 09/23/2011
• Status: Abandoned Application

• Current Assignee: Fudan University
• Original Assignee: Pengfei Wang
• Inventors: Sun, Qingqing, Fang, Runchen, Wang, Pengfei, Zhang, Wei, Yang, Wen
• Application Number:
  US13/528,462
• Publication Number:
  US 20130078761A1
• Time in Patent Office: Days
• US Class Current: 438/104
• CPC Class Codes: H10B 63/30 comprising selection components having three or more electrodes, e.g. transistors
• CPC Class Codes: H10N 70/023 by chemical vapor deposition, e.g. MOCVD, ALD
• CPC Class Codes: H10N 70/20 Multistable switching devices, e.g. memristors
• CPC Class Codes: H10N 70/826 adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
• CPC Class Codes: H10N 70/841 Electrodes
• CPC Class Codes: H10N 70/8833 Binary metal oxides, e.g. TaOx
• CPC Class Codes: H10N 70/8836 Complex metal oxides, e.g. perovskites, spinels

Abstract

The present invention belongs to the technical field of low temperature atomic layer deposition technology, and specifically relates to a method for manufacturing a flexible transparent 1T1R storage unit. In the present invention, a fully transparent 1T1R storage unit is developed on a flexible substrate through a completely low-temperature process, including an oxide layer dielectric, a transparent electrode and a transparent substrate which are deposited together through a low-temperature process, thus realizing a fully transparent device capable of achieving the functions of nontransparent devices. The present invention can be applied to the manufacturing of flexible low-temperature storage units in the future, as well as changing the packaging and existing modes of devices, which will make foldable and bendable portable storage units possible.

Claims

1. A method for manufacturing a flexible transparent 1T1R storage unit, characterized in that it includes the following steps:

provide a flexible substrate;

form a gate electrode on the flexible substrate;

cover the gate electrode to form a gate oxide layer;

form a transparent oxide channel on the gate oxide layer;

form a source and drain electrodes on both sides of the oxide channel;

form an oxide resistive storage layer on the drain electrode;

form a top-electrode on the oxide resistive storage layer.

2. The method for manufacturing a flexible transparent 1T1R storage unit according to claim 1, characterized in that the flexible substrate is formed from polyethylene terephthalate, polyimide, metal or ceramic materials.

3. The method for manufacturing a flexible transparent 1T1R storage unit according to claim 1, characterized in that the gate electrode is formed from indium oxide doped with tin.

4. The method for manufacturing a flexible transparent 1T1R storage unit according to claim 1, characterized in that the gate oxide layer is formed from silicon dioxide, silicon nitride and other high dielectric constant materials.

5. The method for manufacturing a flexible transparent 1T1R storage unit according to claim 1, characterized in that the transparent oxide channel is formed from ZnO or ZnInSnO materials.

6. The method for manufacturing a flexible transparent 1T1R storage unit according to claim 1, characterized in that the source and drain electrodes are formed from ITO or ZnO materials doped with Al or In.

7. The method for manufacturing a flexible transparent 1T1R storage unit according to claim 1, characterized in that the oxide resistive storage layer is formed from TiO₂, ZrO₂, SrTiO₃ or Al₂O₃ materials.

8. The method for manufacturing a flexible transparent 1T1R storage unit according to claim 1, characterized in that the top-electrode is formed from ITO or ZnO materials doped with Al or In.