HEAT TREATMENT METHOD FOR HEATING SUBSTRATE BY IRRADIATING SUBSTRATE WITH FLASH OF LIGHT
First Claim
1. A method of heating a substrate by irradiating the substrate with a flash of light, the method comprising the steps of:
- (a) supporting a substrate on a support member;
(b) irradiating an upper surface of the substrate supported on said support member with a first flash of light to cause said substrate to jump up from said support member; and
(c) irradiating the upper surface of said substrate with a second flash of light to perform a heating treatment while said substrate is jumping in midair above said support member.
2 Assignments
0 Petitions
Accused Products
Abstract
First flash irradiation from flash lamps is performed on an upper surface of a semiconductor wafer supported on a temperature equalizing ring of a holder to cause the semiconductor wafer to jump up from the temperature equalizing ring into midair. While the semiconductor wafer is in midair above the temperature equalizing ring, second flash irradiation from the flash lamps is performed on the upper surface of the semiconductor wafer to increase the temperature of the upper surface of the semiconductor wafer to a treatment temperature. Cracking in the semiconductor wafer is prevented because the second flash irradiation is performed while the semiconductor wafer is in midair and subject to no restraints.
11 Citations
4 Claims
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1. A method of heating a substrate by irradiating the substrate with a flash of light, the method comprising the steps of:
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(a) supporting a substrate on a support member; (b) irradiating an upper surface of the substrate supported on said support member with a first flash of light to cause said substrate to jump up from said support member; and (c) irradiating the upper surface of said substrate with a second flash of light to perform a heating treatment while said substrate is jumping in midair above said support member. - View Dependent Claims (2, 3, 4)
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Specification