COIL PARTS AND METHOD OF FABRICATING THE SAME

• US 20130082812A1
• Filed: 03/06/2012
• Published: 04/04/2013
• Est. Priority Date: 09/30/2011
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Yoo, Young Seuck, Kwak, Jeong Bok, Kim, Yong Suk, Lee, Sang Moon, Hur, Kang Heon, Wi, Sung Kwon
• Granted Patent: US 9,147,512 B2
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01F 5/003 Printed circuit coils
• CPC Class Codes: Y10T 29/49073 by assembling coil and core

Abstract

A coil part is provided. The coil part includes a coil layer including a core and a first coil and a second coil disposed on and under the core, a lower magnetic layer bonded under the coil layer, and an upper magnetic layer bonded on the coil layer. Accordingly, it is possible to improve process and productivity and cut fabrication costs by preventing process defects that occur during the fabrication process of a coil part using a ferrite substrate.

Claims

1. A coil part, which comprises:

a coil layer including a core and a first coil and a second coil disposed on and under the core;

a lower magnetic layer bonded under the coil layer; and

an upper magnetic layer bonded on the coil layer.

2. The coil part according to claim 1, wherein the core is formed of at least one of a glass epoxy, a Bismaleimide Triazine (BT) resin, and a polyimide.

3. The coil part according to claim 1, wherein the first coil and the second coil are formed in the shape of a coil by patterning metal layers disposed on and under the core.

4. The coil part according to claim 3, wherein the patterning is performed through a lithography process.

5. The coil part according to claim 3, wherein the first coil and the second coil are patterned simultaneously on both surfaces of the core.

6. The coil part according to claim 1, wherein each of the lower magnetic layer and the upper magnetic layer is bonded to the coil layer through an adhesive layer.

7. The coil part according to claim 6, wherein the adhesive layer is disposed in the periphery of the coil layer such that a space is formed between the coil layer and the upper magnetic layer and between the coil layer and the lower magnetic layer.

8. The coil part according to claim 1, which further comprises a central magnetic layer that protrudes from any one of the upper magnetic layer and the lower magnetic layer and pierces the center of the coil layer.

9. The coil part according to claim 1, which further comprises:

a first external extraction electrode disposed at the upper magnetic layer and connected electrically to the first coil; and

a second external extraction electrode disposed at the lower magnetic layer and connected electrically to the second coil.

10. The coil part according to claim 1, wherein the lower magnetic layer and the upper magnetic layer are formed in the shape of a sheet including a ferrite.

11. A coil part, which comprises:

a first coil layer including a first core and a first upper coil and a first lower coil disposed on and under the first core;

a second coil layer corresponding to the first coil layer and including a second core and a second upper coil and a second lower coil disposed on and under the second core;

a first magnetic layer bonded to the first coil layer; and

a second magnetic layer bonded to the second coil layer.

12. The coil part according to claim 11, wherein the first core and the second core are formed of at least one of a glass epoxy, a Bismaleimide Triazine (BT) resin, and a polyimide.

13. The coil part according to claim 11, wherein the first upper coil and the first lower coil are formed in the shape of a coil by patterning metal layers disposed on and under the first core, and the second upper coil and the second lower coil are formed in the shape of a coil by patterning metal layers disposed on and under the second core.

14. The coil part according to claim 13, wherein the patterning is performed through a lithography process.

15. The coil part according to claim 13, wherein the first upper coil and the first lower coil are patterned simultaneously on both surfaces of the first core, and the second upper coil and the second lower coil are patterned simultaneously on both surfaces of the second core.

16. The coil part according to claim 11, wherein the first magnetic layer and the second magnetic layer are bonded respectively to the first coil layer and the second coil layer through an adhesive layer.

17. The coil part according to claim 11, wherein the first magnetic layer and the second magnetic layer are formed in the shape of a sheet including a ferrite.

18. The coil part according to claim 11, wherein the first upper coil and the first lower coil of the first coil layer are electrically connected through a first conductive via piercing the first core, and the second upper coil and the second lower coil of the second coil layer are electrically connected through a second conductive via piercing the second core.

19. The coil part according to claim 18, wherein the first conductive via includes a first via hole piercing the first core, and a first plating layer disposed in the first via hole such that the first upper coil side and the first lower coil side are formed to be symmetrical to each other;

and

the second conductive via includes a second via hole piercing the second core, and a second plating layer disposed in the second via hole such that the second upper coil side and the second lower coil side are formed to be symmetrical to each other.

20. A method of fabricating a coil part that includes a coil layer and an upper magnetic layer and a lower magnetic layer bonded respectively on and under the coil layer, which comprises:

forming a coil layer by forming an upper coil and a lower coil on and under a core; and

bonding an upper magnetic layer and a lower magnetic layer on and under the coil layer.

21. The method according to claim 20, wherein the forming of the coil layer includes:

forming metal layers on and under a core; and

patterning the metal layers to form a first coil and a second coil.

22. The method according to claim 21, wherein the patterning is performed simultaneously on both surfaces of the core through a lithography process.

23. The method according to claim 20, wherein the upper magnetic layer and the lower magnetic layer are bonded to the coil layer through an adhesive layer.