HEAT DISSIPATION APPARATUS FOR MEDIUM-VOLTAGE DRIVE

• US 20130083485A1
• Filed: 12/08/2011
• Published: 04/04/2013
• Est. Priority Date: 09/29/2011
• Status: Abandoned Application

• Current Assignee: Delta Electronics Company Limited (Delta Electronics Incorporated)
• Original Assignee: Delta Electronics Company Limited (Delta Electronics Incorporated)
• Inventors: Gan, Hong-Jian, Tong, Ai-Xing
• Application Number:
  US13/314,700
• Publication Number:
  US 20130083485A1
• Time in Patent Office: Days
• US Class Current: 361/700
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipation apparatus is suitable for dissipating heat from heat-generating elements in a medium-voltage drive. The heat dissipation apparatus comprises: a heat-dissipating substrate, wherein the heat-generating elements are placed on at least one of a first surface and a second surface of the heat-dissipating substrate; at least one heat pipe group each of which includes a plurality of heat pipes, each heat pipe having an evaporation section and a condensation section, wherein the evaporation section is buried in an inner layer of the heat-dissipating substrate for absorbing heat from the heat-generating elements; and a plurality of fins arranged to be intersected with each heat pipe and connected to the condensation sections of the heat pipes, so as to transfer the heat released from the condensation sections to air. The contact portions between the heat pipe group and the fins are arranged in triangle staggered arrangements.

Claims

1. A heat dissipation apparatus, suitable to dissipate heat from a plurality of heat-generating elements in a medium-voltage drive, comprising:

a heat-dissipating substrate having a first surface, a second surface and an inner layer between the first surface and the second surface, wherein the heat-generating elements are placed on at least one of the first surface and the second surface;

at least one heat pipe group, each of the at least one heat pipe group comprising a plurality of heat pipes, wherein each of the heat pipes has an evaporation section and a condensation section, and the evaporation section is buried in the inner layer of the heat-dissipating substrate for absorbing heat from the heat-generating elements; and

a plurality of fins arranged to be intersected with each of the heat pipes, and fixed and connected to the condensation section of each of the heat pipes, so as to transfer heat released by the condensation section to air,

wherein contact portions between the at least one heat pipe group and the fins are in staggered arrangements.

2. The heat dissipation apparatus of claim 1, wherein at least one of the heat pipes of each of the at least one heat pipe group further has a bent portion, and the bent portion is located between the evaporation section and the condensation section.

3. The heat dissipation apparatus of claim 1, wherein the heat-generating elements comprise at least one first heating element and at least one second heat-generating element, wherein the at least one first heat-generating element is placed on the first surface, and the at least one second heat-generating element is placed on the second surface.

4. The heat dissipation apparatus of claim 3, wherein the first heat-generating element is a high-frequency power device, and the second heat-generating element is a low-frequency power device, and a high-frequency circuit and a low-frequency circuit of the first heat-generating element and the second heat-generating element are isolated by the heat-dissipating substrate.

5. The heat dissipation apparatus of claim 1, wherein the heat-generating elements comprise an IGBT (Insulated Gate Bipolar Transistor), an IGCT (Integrated Gate Commutated Thyristor), an IEGT (Injection Enhanced Gate Transistor) or a diode.

6. The heat dissipation apparatus of claim 3, wherein the heat pipe groups corresponding to the heat-generating elements are arranged at the same interval in parallel on the inner layer of the heat-dissipating substrate.

7. The heat dissipation apparatus of claim 3, wherein the heat pipe groups corresponding to the heat-generating elements are arranged in a staggered manner on the inner layer of the heat-dissipating substrate.

8. The heat dissipation apparatus of claim 7, wherein the at least one heat pipe group comprises a first heat pipe subgroup and a second heat pipe subgroup;

the first heat pipe subgroup is fixed on the inner layer of the heat-dissipating substrate at a position near the first surface and the first heat-generating element; and

the second heat pipe subgroup is fixed on the inner layer of the heat-dissipating substrate at a position near the second surface and the second heat-generating element.

9. The heat dissipation apparatus of claim 1, wherein the condensation sections of different heat pipe groups are set to have the same length or different lengths according to heat generation and heat dissipation requirements of the heat-generating elements corresponding thereto.

10. The heat dissipation apparatus of claim 1, wherein the evaporation sections of the heat pipes buried in the inner layer of the heat-dissipating substrate are set to have the same depth or different depths according to installation position requirements of the heat-generating elements corresponding thereto.

11. The heat dissipation apparatus of claim 1, wherein the evaporation sections of different heat pipe groups are set to have the same heat pipe diameter or different heat pipe diameters according to heat dissipation requirements of the heat-generating elements corresponding thereto.

12. The heat dissipation apparatus of claim 1, wherein the number of the heat pipes corresponding to different heat-generating elements is set according to respective heat dissipation requirements.

13. The heat dissipation apparatus of claim 1, wherein the heat pipes are gravity heat pipes, screen heat pipes, sintered heat pipes or groove heat pipes.

14. The heat dissipation apparatus of claim 13, wherein working liquid in the heat pipes is water, acetone, liquid ammonia, ethanol or R134a refrigerant.

15. The heat dissipation apparatus of claim 1, wherein the fins are intersected with each of the heat pipes with an intersection angle of 90°

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