High Intensity LED Replacement of Incandescent Lamps

• US 20130083533A1
• Filed: 05/10/2011
• Published: 04/04/2013
• Est. Priority Date: 05/11/2010
• Status: Active Grant

• Current Assignee: Polybrite International, Inc. (Goeken Group Corp.)
• Original Assignee: Polybrite International, Inc. (Goeken Group Corp.)
• Inventors: Janik, Raymond G., Scianna, Carlo, Thompson, Ted Lowl
• Granted Patent: US 9,599,322 B2
• Time in Patent Office: Days
• US Class Current: 362/249.02
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21V 21/00 Supporting, suspending, or attaching arrangements for lighting devices F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00; Hand grips
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21Y 2107/40 on the sides of polyhedrons, e.g. cubes or pyramids
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/14 Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 2201/047 Box-like arrangements of PCBs
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A method of forming a light bulb core, and a light bulb or lamp incorporating the core. The method includes forming a heat sink having at least six working facets located equally on opposite sides of a central plane, and then mounting a light source on each of the working facets. The light sources are mounted on circuit boards, each circuit board corresponding to a respective one of the working facets. The boards are then applied to respective working facets. The bulb is composed of a screw base, an external heat sink mounted in the screw base, and the light bulb core mounted in and extending from the external heat sink. The light source comprises a plurality of light emitting diodes.

Claims

1. A light bulb, comprising

a. a screw base,

b. an external heat sink mounted in said screw base,

c. an internal heat sink extending from said external heat sink, said internal heat sink having at least six working facets, and

d. a light emitting source mounted on each working facet.

2. The light bulb according to claim 1, in which said light source comprises a plurality of light emitting diodes (LEDs).

3. The light bulb according to claim 2, in which the LEDs of each facet are mounted on a circuit board secured to the facet.

4. The light bulb according to claim 1, in which said internal heat sink is metal.

5. The light bulb according to claim 1, in which said facets are located in mirror image relationship on opposite sides of a central plane.

6. The light bulb according to claim 5, in which said facets are formed at an angular relationship with one another.

7. A method of forming a light bulb core, comprising the steps of

a. forming a heat sink having at least six working facets, said working facets being located equally on opposite sides of a central plane, and

b. mounting a light source on each working facet.

8. The method according to claim 7, in which method step “

a”

includes locating said facets in mirror image relationship on opposite sides of said central plane.

9. The method according to claim 7, in which method step “

b”

includes the steps of

i. locating said light sources on circuit boards, with each circuit board corresponding to a respective one of said working facets, and then

ii. applying said circuit boards to the respective one of said working facets.

10. The method according to claim 9, including the step, between method steps “

i” and

“

ii”

, of electrically connecting said circuit boards to one another.

11. The method according to claim 10, in which, before method step “

i”

, including the steps of forming said circuit boards in a planar array interconnected by frangible tabs, and electrically connecting said circuit boards while in said planar array.

12. The method according to claim 11, including fracturing at least some of said tabs before method step “

b”

.