Selective Metal Deposition Over Dielectric Layers
First Claim
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1. A method of performing selective electroless plating comprising:
- providing a substrate having a first dielectric layer thereover;
forming a conductive layer directly on at least a portion of the first dielectric layer;
forming a hydrogen rich target layer over the conductive layer;
forming an opening to form a contact on the conductive layer;
performing selective electroless plating of a thin film over the contact.
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Abstract
Selective deposition of metal over dielectric layers in a manner that minimizes of eliminates keyhole formation is provided. According to one embodiment, a dielectric target layer is formed over a substrate layer, wherein the target layer may be configured as allow conformal metal deposition, and a dielectric second layer is formed over the target layer, wherein the second layer may be configured to allow bottom-up metal deposition. An opening may then be formed in the second layer and metal may be selectively deposited over substrate layer.
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Citations
14 Claims
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1. A method of performing selective electroless plating comprising:
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providing a substrate having a first dielectric layer thereover; forming a conductive layer directly on at least a portion of the first dielectric layer; forming a hydrogen rich target layer over the conductive layer; forming an opening to form a contact on the conductive layer; performing selective electroless plating of a thin film over the contact. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification