OPTICAL SEMICONDUCTOR LIGHTING APPARATUS

• US 20130088871A1
• Filed: 07/20/2012
• Published: 04/11/2013
• Est. Priority Date: 10/11/2011
• Status: Active Grant

• Current Assignee: Posco Led Company Ltd. (TMS Co., Ltd.)
• Original Assignee: Posco Led Company Ltd. (TMS Co., Ltd.)
• Inventors: KIM, Jung Hwa, KIM, Kyoo Seok, YUN, Kyung Min, KIM, Dong Soo, KIM, Min Su
• Granted Patent: US 8,602,609 B2
• Time in Patent Office: Days
• US Class Current: 362/249.01
• CPC Class Codes: F21S 4/28 rigid, e.g. LED bars
• CPC Class Codes: F21V 17/164 the parts being subjected to bending, e.g. snap joints
• CPC Class Codes: F21V 23/006 the substrate being distinct from the light source holder
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21V 29/506 of globes, bowls or cover glasses
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/777 the planes containing the fins or blades having directions perpendicular to the light emitting axis
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 3/062 the material being plastics
• CPC Class Codes: F21V 3/0625 the material diffusing light, e.g. translucent plastics
• CPC Class Codes: F21V 31/005 Sealing arrangements therefor
• CPC Class Codes: F21V 5/007 Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane combination of two or more refractors F21V5/008
• CPC Class Codes: F21W 2131/10 Outdoor lighting
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2113/00 Combination of light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

An optical semiconductor lighting apparatus includes a heat sink including a heat dissipation base and a plurality of heat dissipation fins formed on a lower surface of the heat dissipation base; an optical semiconductor device placed on the heat dissipation base; and an optical cover coupled to an upper side of the heat sink to cover the optical semiconductor device. The heat dissipation base is formed with an air flow hole through which upper ends of the heat dissipation fins are exposed.

Claims

1. An optical semiconductor lighting apparatus comprising:

a heat sink including a heat dissipation base and a plurality of heat dissipation fins formed on a lower surface of the heat dissipation base, the heat dissipation base being formed with an air flow hole through which upper ends of the heat dissipation fins are exposed;

an optical semiconductor device placed on the heat dissipation base; and

an optical cover coupled to an upper side of the heat sink to cover the optical semiconductor device.

2. The optical semiconductor lighting apparatus of claim 1, wherein the optical cover is formed with an opening through which the air flow hole and the heat dissipation fins are exposed.

3. The optical semiconductor lighting apparatus of claim 1, wherein the heat dissipation base comprises a printed circuit board mounting region around the air flow hole, and the printed circuit board comprises a plurality of optical semiconductor devices mounted thereon.

4. The optical semiconductor lighting apparatus of claim 1, wherein each of the heat dissipation fins is integrally formed with an upward extending portion which extend above an upper surface of the heat dissipation base through the air flow hole.

5. The optical semiconductor lighting apparatus of claim 1, wherein the heat dissipation base comprises a partition wall protruding along a circumference of the air flow hole.

6. The optical semiconductor lighting apparatus of claim 2, wherein the heat dissipation base comprises a partition wall protruding along a circumference of the air flow hole to be inserted into the opening of the optical cover.

7. The optical semiconductor lighting apparatus of claim 1, wherein each of the heat dissipation fins is integrally formed with an upward extending portion, which extends above an upper surface of the heat dissipation base through the air flow hole and is connected at both sides thereof with a partition wall protruding along a circumference of the air flow hole.

8. The optical semiconductor lighting apparatus of claim 2, wherein the optical cover comprises an inner wall formed along a circumference of the opening and extending downwards to be inserted into an upper portion of the air flow hole.

9. The optical semiconductor lighting apparatus of claim 1, wherein the optical cover comprises a lens portion corresponding to the optical semiconductor device.

10. The optical semiconductor lighting apparatus of claim 1, wherein the heat dissipation base comprises male and female connectors placed on opposite sides thereof, respectively, at least one the male and female connectors being connected to a female or male connector of another heat dissipation base adjacent the heat dissipation base.

11. The optical semiconductor lighting apparatus of claim 1, wherein the heat dissipation base has a width and a length, the air flow hole is longitudinally formed in an elongated shape at the middle of the heat dissipation base, the heat dissipation base is provided on an upper surface thereof with a pair of longitudinally elongated regions with the air flow hole interposed therebetween, and the printed circuit board including the optical semiconductor devices is mounted on the longitudinally elongated regions.

12. The optical semiconductor lighting apparatus of claim 7, wherein the heat dissipation fins and the upward extending portions divide the air flow hole into a plurality of cell-type holes.

13. An optical semiconductor lighting apparatus comprising:

a heat sink including a heat dissipation base, the heat dissipation base being formed with an air flow hole;

at least one circuit board mounted on the heat dissipation base;

a plurality of optical semiconductor devices mounted on the circuit board; and

an optical cover disposed to cover the optical semiconductor devices.

14. The optical semiconductor lighting apparatus of claim 13, wherein the optical cover comprises an opening corresponding to the air flow hole.

15. The optical semiconductor lighting apparatus of claim 14, wherein the heat dissipation base comprises a partition wall protruding along a circumference of the air flow hole.

16. The optical semiconductor lighting apparatus of claim 15, wherein the partition wall is inserted into the opening of the optical cover.

17. The optical semiconductor lighting apparatus of claim 13, wherein the optical cover comprises an inner wall formed along a circumference of the opening and extending downwards to be inserted into an upper portion of the air flow hole.

18. An optical semiconductor lighting apparatus comprising:

a first light emitting module; and

a second light emitting module disposed adjacent the first light emitting module,

the first light emitting module being provided at one side thereof with a female connector, the second light emitting module being provided, at the other side thereof facing the one side of the first light emitting module, with a male connector inserted into and connected to the female connector.

19. An optical semiconductor lighting apparatus comprising:

a light emitting module including at least one optical semiconductor device;

a heat sink including a plurality of heat dissipation fins formed on the light emitting module; and

an air flow passage formed in a space between adjacent heat dissipation fins.

20. The optical semiconductor lighting apparatus of claim 19, wherein the heat sink comprises a heat dissipation base coupled to the light emitting module and a plurality of heat dissipation fins extending from the heat dissipation base.

21. The optical semiconductor lighting apparatus of claim 20, wherein the heat sink comprises an air flow passage formed in a space between adjacent heat dissipation fins and the heat dissipation base.

22. The optical semiconductor lighting apparatus of claim 19, wherein the heat sink comprises a plurality of heat dissipation fins disposed in a longitudinal direction of the light emitting module, and a heat sink base disposed at one side of the heat sink to connect one side of each of the heat dissipation fins to one side of another heat dissipation fin and having the light emitting module mounted thereon.

23. The optical semiconductor lighting apparatus of claim 19, further comprising:

a service unit disposed on at least one side of the heat sink and electrically connected to the light emitting module.

24. The optical semiconductor lighting apparatus of claim 22, wherein the heat sink further comprises a lip extending from one side of the heat dissipation base and separated from a connecting portion between the heat dissipation base and the heat dissipation fins, and an air slot formed in a longitudinal direction of the lip.

25. The optical semiconductor lighting apparatus of claim 22, wherein the heat sink has a slanted edge facing edges of the heat dissipation fins on which the heat dissipation base is disposed, the slanted edge being slanted from one side to the other side, and the heat dissipation base adjoins one side of each of the heat dissipation fins.

26. The optical semiconductor lighting apparatus of claim 22, wherein the heat sink further comprises a reinforcing rib extending from an edge facing edges of the heat dissipation fins connected to the heat dissipation base to connect all of the heat dissipation fins to each other.

27. The optical semiconductor lighting apparatus of claim 23, wherein the air flow passage comprises an inlet formed near one side of the heat dissipation base at the one side of each of the heat dissipation fins, and an outlet formed at one end of an edge facing edges of the heat dissipation fins on which the heat dissipation base is disposed.

28. The optical semiconductor lighting apparatus of claim 25, wherein the heat sink comprises an air baffle covering the plurality of heat dissipation fins from the slanted edge facing the edges of the heat dissipation fins on which the heat dissipation base is disposed, to an edge extending from the slanted edge.

29. The optical semiconductor lighting apparatus of claim 19, wherein the service unit comprises a unit body formed on either side of the heat sink and a connector formed on the unit body.

30. The optical semiconductor lighting apparatus of claim 19, wherein the service unit comprises a unit body formed on either side of the heat sink and a driving printed circuit board formed on the unit body.

31. The optical semiconductor lighting apparatus of claim 19, wherein the service unit comprises a unit body formed on either side of the heat sink and a charge/discharge device formed on the unit body.