SONIC SENSORS AND PACKAGES

• US 20130088941A1
• Filed: 10/05/2011
• Published: 04/11/2013
• Est. Priority Date: 10/05/2011
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Elian, Klaus, Theuss, Horst
• Granted Patent: US 9,239,386 B2
• Time in Patent Office: Days
• US Class Current: 367/99
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: G01S 15/08 Systems for measuring distance only indirect measurement G01S15/46
• CPC Class Codes: G01S 15/10 using transmission of interrupted, pulse-modulated waves determination of distance by phase measurement G01S15/32
• CPC Class Codes: G01S 7/521 Constructional features
• CPC Class Codes: G10K 11/004 Mounting transducers, e.g. provided with mechanical moving or orienting device mountings specially adapted to a particular sound-producing device, see the preceding groups G10K1/00 - G10K9/00, e.g. G10K1/26, G10K1/28, G10K9/22; arrangements of sonic watch equipment on submarines B63G8/39; buoys B63B22/00
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005
• CPC Class Codes: H10N 30/2047 Membrane type
• CPC Class Codes: H10N 30/88 Mounts; Supports; Enclosures; Casings

Abstract

Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver.

Claims

1. A sensor system comprising:

a silicon microphone;

a controller integrated circuit coupled to the microphone;

a transmitter coupled to the controller integrated circuit and comprising a piezoelectric element; and

a housing comprising a cover portion having an aperture, wherein the microphone, the controller integrated circuit and the transmitter are provided within the housing.

2. The sensor system of claim 1, wherein the microphone is arranged opposite the aperture.

3. The sensor system of claim 1, wherein the cover portion comprises the piezoelectric element.

4. The sensor system of claim 3, wherein the housing comprises a transmitter portion for the transmitter and a receiver portion for the receiver, the cover portion comprises a transmitter cover portion and a receiver cover portion, the transmitter cover portion comprises the piezoelectric element, and the aperture is formed in the receiver cover portion.

5. The sensor system of claim 4, wherein the receiver cover portion comprises metal.

6. The sensor system of claim 1, wherein the piezoelectric element comprises at least one of metal, ceramic, plastic or foil.

7. The sensor system of claim 6, wherein the piezoelectric element comprises a polyvinylidenfluorid (PVDF) foil.

8. The sensor system of claim 6, wherein the piezoelectric element comprises lead zirconate titanate (PZT) and metal.

9. The sensor system of claim 1, wherein the cover portion comprises a metal shielding portion.

10. The sensor system of claim 1, wherein the silicon microphone comprises a microelectromechanical system (MEMS) microphone.

11. The sensor system of claim 1, wherein the controller integrated circuit comprises an amplifier.

12. The sensor system of claim 1, wherein the transmitter comprises an ultrasonic transmitter.

13. The sensor system of claim 1, wherein the transmitter comprises one of a supersonic, a sonar or a radar transmitter.

14. A method comprising:

providing an integrated sensor including a transmitter, a microelectromechanical (MEMS) microphone and driver electronics integrated in a housing having a cover comprising a piezoelectric element;

transmitting a signal by the transmitter and the piezoelectric element;

receiving a reflected signal by the receiver through an aperture in the cover; and

determining a time of flight of the signal.

15. The method of claim 14, further comprising determining a distance, from the sensor, of an object reflecting the signal from the time of flight of the signal.

16. The method of claim 14, wherein transmitting a signal comprises transmitting one of an ultrasonic signal, a supersonic signal, a sonar signal or a radar signal.

17. The method of claim 14, further comprising forming the housing with a transmitter portion having a transmitter portion cover comprising the piezoelectric element and a receiver portion having a receiver portion cover.

18. The method of claim 17, wherein forming the housing further comprises forming the piezoelectric element from at least one of metal, ceramic, plastic or foil.

19. The method of claim 17, wherein forming the housing further comprises forming the receiver portion cover from metal.

20. The method of claim 14, further comprising mounting the sensor in a vehicle.

21. The method of claim 20, wherein the vehicle is selected from the group consisting of an automobile, a bicycle, an electric bicycle, a scooter, a SEGWAY, construction equipment and a boat.

22. The method of claim 14, further comprising mounting the sensor in one of a mobile phone or a gaming system.

23. The method of claim 22, wherein the gaming system is one of a handheld gaming system or a console gaming system.

24. A semiconductor chip package comprising:

a housing for at least one semiconductor chip, wherein at least a portion of the housing is configured as a sound generating element to generate sound waves based on electrical signals provided by an integrated circuit of the at least one semiconductor chip.

25. The semiconductor chip package of claim 24, wherein the housing further includes a sound inlet portion configured to transmit sound from external to the semiconductor package to a semiconductor microphone provided within the semiconductor chip package.

26. The semiconductor chip package of claim 24, wherein at least a portion of the housing is configured to function as a membrane.

27. The semiconductor chip package of claim 24, wherein the sound generating element is a piezoelectric layer.