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STRUCTURE FOR STACKING PRINTED BOARD ASSEMBLIES IN ELECTRONIC DEVICE

  • US 20130089992A1
  • Filed: 03/14/2012
  • Published: 04/11/2013
  • Est. Priority Date: 10/10/2011
  • Status: Active Grant
First Claim
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1. A structure for stacking Printed Board Assemblies (PBAs) in an electronic device, the structure comprising:

  • a clip mounted on a main Printed Circuit Board (PCB);

    a sub-PCB comprising a ground portion;

    a sub-PBA comprising the sub-PCB; and

    a clip header mounted on a lower part of the sub-PBA,wherein the clip header is inserted into the clip.

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