IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD USING SAME

• US 20130093113A1
• Filed: 10/11/2012
• Published: 04/18/2013
• Est. Priority Date: 10/14/2011
• Status: Active Grant

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Hayashi, Tatsuya, Hasegawa, Noriyasu, Torii, Hirotoshi, Tanaka, Yusuke, Murakami, Yosuke
• Granted Patent: US 9,594,301 B2
• Time in Patent Office: Days
• US Class Current: 264/40.1
• CPC Class Codes: B29C 43/021 characterised by the shape of the surface
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: G03F 7/0002 Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Abstract

An imprint apparatus transfers a pattern formed on a mold to a resin on a substrate. The imprint apparatus includes a shape correction mechanism configured to apply a force to the mold to thereby deform a pattern region formed on the mold; a heating mechanism configured to heat a substrate-side pattern region formed on the substrate to thereby deform the substrate-side pattern region; and a control unit configured to obtain information regarding a difference between shapes of the pattern region formed on the mold and the substrate-side pattern region and control the shape correction mechanism and the wafer heating mechanism so as to reduce the difference between the shapes of the pattern region formed on the mold and the substrate-side pattern region based on the obtained information.

Claims

1. An imprint apparatus that transfers a pattern formed on a mold to a resin on a substrate, the imprint apparatus comprising:

a shape correction mechanism configured to apply a force to the mold to thereby deform a pattern region formed on the mold;

a heating mechanism configured to heat a substrate-side pattern region formed on the substrate to thereby deform the substrate-side pattern region; and

a control unit configured to obtain information regarding a difference between shapes of the pattern region formed on the mold and the substrate-side pattern region and control the shape correction mechanism and the heating mechanism so as to reduce the difference between the shapes of the pattern region formed on the mold and the substrate-side pattern region based on the obtained information.

2. The imprint apparatus according to claim 1, further comprising:

a detection unit configured to detect a plurality of marks formed on the mold and a plurality of marks formed on the substrate,

wherein the control unit obtains the information based on a result detected by the detection unit.

3. The imprint apparatus according to claim 1, wherein the detection unit measures at least four marks formed on the mold and at least four marks formed on the substrate.

4. The imprint apparatus according to claim 2, wherein the detection unit measures at least four marks formed on the mold and at least four marks formed on the substrate.

5. The imprint apparatus according to claim 1, wherein the control unit controls the heating mechanism so as to form temperature distribution on the substrate-side pattern region.

6. The imprint apparatus according to claim 1, wherein the heating mechanism is capable of heating only a partial region of the substrate, and the control unit determines a region to be heated by the heating mechanism based on the obtained information.

7. The imprint apparatus according to claim 1, wherein the heating mechanism comprises a light source and heats the substrate-side pattern region by irradiating the substrate with light emitted from the light source.

8. The imprint apparatus according to claim 7, wherein the resin is a resin that is curable by ultraviolet light and a wavelength of light irradiated onto the substrate using the heating mechanism is in a range of from 400 nm to 2000 nm.

9. The imprint apparatus according to claim 1, wherein the control unit controls the heating mechanism in a state where the resin on the substrate is brought into contact with the mold.

10. The imprint apparatus according to claim 1, wherein the control unit causes the heating mechanism to deform the substrate-side pattern region after the pattern region formed on the mold is deformed by the shape correction mechanism or during the deformation of the pattern region formed on the mold by the shape correction mechanism.

11. A device manufacturing method for manufacturing a device, the method comprising:

transferring a pattern formed on a mold to a resin on a substrate using an imprint apparatus; and

etching the substrate on which the transferred pattern has been formed,

wherein the imprint apparatus comprises;

a shape correction mechanism configured to apply a force to the mold to thereby deform a pattern region formed on the mold;

a heating mechanism configured to heat a substrate-side pattern region formed on the substrate to thereby deform the substrate-side pattern region; and

a control unit configured to obtain information regarding a difference between shapes of the pattern region formed on the mold and the substrate-side pattern region and control the shape correction mechanism and the heating mechanism so as to reduce the difference between the shapes of the pattern region formed on the mold and the substrate-side pattern region based on the obtained information.

12. An imprint method for transferring a pattern formed on a mold to a resin on a substrate, the method comprising:

applying a force to the mold to thereby deform a pattern region formed on the mold;

heating a substrate-side pattern region formed on the substrate to thereby deform the substrate-side pattern region; and

curing the resin on the substrate in a state where the pattern region formed on the mold and the substrate-side pattern region are deformed.

13. The imprint method according to claim 12, wherein the heating is performed prior to the force application or is performed simultaneously with the force application.

14. The imprint method according to claim 12, further comprising:

bringing the mold into contact with the resin on the substrate,

wherein the heating is performed in a state where the mold is brought into contact with the resin on the substrate.

15. The imprint method according to claim 13, further comprising:

bringing the mold into contact with the resin on the substrate,

wherein the heating is performed in a state where the mold is brought into contact with the resin on the substrate.

16. The imprint method according to claim 12, further comprising:

detecting a plurality of marks formed on the mold and a plurality of marks formed on the substrate-side pattern region.