MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF

• US 20130093556A1
• Filed: 01/03/2012
• Published: 04/18/2013
• Est. Priority Date: 10/12/2011
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: LIM, Bong Sup
• Application Number:
  US13/342,708
• Publication Number:
  US 20130093556A1
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 27/29 Terminals; Tapping arrangements for signal inductances
• CPC Class Codes: H01G 4/002 Details
• CPC Class Codes: H01G 4/12 Ceramic dielectrics H01G4/085 takes precedence
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence

Abstract

There are provided a multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength, and a fabrication method thereof. Dummy electrodes connected to the outer electrodes are formed on cover areas and an active area of a ceramic main body. A multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength can be obtained.

Claims

1. A multilayered ceramic electronic component comprising:

a ceramic main body including outer electrodes formed thereon;

conductive patterns laminated within the ceramic main body; and

first dummy patterns disposed on cover areas of the ceramic main body, electrically separated from the conductive patterns, and exposed outwardly from the ceramic main body.

2. The multilayered ceramic electronic component of claim 1, wherein the first dummy patterns are disposed within regions of the ceramic main body, covered by the outer electrodes.

3. The multilayered ceramic electronic component of claim 1, wherein the first dummy patterns are exposed to end faces perpendicular to a length direction of the ceramic main body, in which the outer electrodes are connected thereto and extended therefrom.

4. The multilayered ceramic electronic component of claim 1, wherein the first dummy patterns are exposed to end faces perpendicular to a length direction of the ceramic main body, in which the outer electrodes are connected thereto and extended therefrom and side faces adjacent thereto.

5. The multilayered ceramic electronic component of claim 1, wherein the first dummy patterns are disposed on at least one of top and bottom faces of the ceramic main body.

6. The multilayered ceramic electronic component of claim 1, wherein the first dummy patterns have a roughly “

└

”

-like shape or a roughly “

[”

-like shape, when viewed in a lamination direction of the conductive patterns.

7. The multilayered ceramic electronic component of claim 1, wherein the first dummy patterns have a quadrangular shape, when viewed in a lamination direction of the conductive patterns.

8. The multilayered ceramic electronic component of claim 1, wherein each of the first dummy patterns is formed to be divided into two or more parts.

9. The multilayered ceramic electronic component of claim 1, further comprising second dummy patterns disposed on an active area of the ceramic main body, electrically separated from the conductive patterns, and exposed outwardly from the ceramic main body.

10. The multilayered ceramic electronic component of claim 9, wherein the second dummy patterns are disposed within regions of the ceramic main body, covered by the outer electrodes.

11. The multilayered ceramic electronic component of claim 9, wherein the second dummy patterns are exposed to end faces perpendicular to a length direction of the ceramic main body, in which the outer electrodes are connected thereto and extended therefrom.

12. The multilayered ceramic electronic component of claim 9, wherein the second dummy patterns are exposed to end faces perpendicular to a length direction of the ceramic main body, in which the outer electrodes are connected thereto and extended therefrom and side faces adjacent thereto.

13. The multilayered ceramic electronic component of claim 9, wherein the second dummy patterns have a roughly “

└

”

-like shape, when viewed in a lamination direction of the conductive patterns.

14. The multilayered ceramic electronic component of claim 9, wherein the second dummy patterns have a quadrangular shape, when viewed in a lamination direction of the conductive patterns.

15. The multilayered ceramic electronic component of claim 9, wherein each of the second dummy patterns are formed to be divided into two or more parts.

16. The multilayered ceramic electronic component of claim 1, wherein the ceramic main body includes a magnetic material or a dielectric material.

17. A method of fabricating a multilayered ceramic electronic component, the method comprising:

forming a first dummy pattern on a ceramic green sheet to prepare a first ceramic green sheet;

forming a conductive pattern and a second dummy pattern on another ceramic green sheet to prepare a second ceramic green sheet;

laminating the first and second green sheets to prepare a laminate;

cutting the laminate such that the first and second dummy patterns are exposed to the outside, and firing the cut laminate; and

forming outer electrodes on the fired laminate.

18. The method of claim 17, wherein the first dummy pattern is disposed within regions of the fired laminate, covered by the outer electrodes.

19. The method of claim 17, wherein the first dummy pattern is exposed to an end face perpendicular to a length direction of the fired laminate, in which the outer electrodes are connected thereto and extended therefrom.

20. The method of claim 17, wherein the first dummy pattern is exposed to an end face perpendicular to a length direction of the fired laminate, in which the outer electrodes are connected thereto and extended therefrom, and side faces adjacent thereto.

21. The method of claim 17, wherein the first dummy pattern is disposed on at least one of top and bottom faces of the fired laminate.

22. The method of claim 17, wherein the first dummy pattern has a roughly “

└

”

-like shape or a roughly “

[”

-like shape, when viewed in a lamination direction of the conductive pattern.

23. The method of claim 17, wherein the first dummy pattern has a quadrangular shape, when viewed in a lamination direction of the conductive pattern.

24. The method of claim 17, wherein the first dummy pattern is formed to be divided into two or more parts.

25. The method of claim 17, wherein the second dummy pattern is disposed within regions of the fired laminate, covered by the outer electrodes.

26. The method of claim 17, wherein the second dummy pattern is exposed to an end face perpendicular to a length direction of the fired laminate, in which the outer electrodes are connected thereto and extended therefrom.

27. The method of claim 17, wherein the second dummy pattern is exposed to an end face perpendicular to a length direction of the fired laminate, in which the outer electrodes are connected thereto and extended therefrom, and side faces adjacent thereto.

28. The method of claim 17, wherein the second dummy pattern has a roughly “

└

”

-like shape, when viewed in a lamination direction of the conductive pattern.

29. The method of claim 17, wherein the second dummy pattern has a quadrangular shape, when viewed in a lamination direction of the conductive pattern.

30. The method of claim 17, wherein the second dummy pattern is formed to be divided into two or more parts.

31. The method of claim 17, wherein the fired laminate includes a magnetic material or a dielectric material.