MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF
First Claim
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1. A multilayered ceramic electronic component comprising:
- a ceramic main body including outer electrodes formed thereon;
conductive patterns laminated within the ceramic main body; and
first dummy patterns disposed on cover areas of the ceramic main body, electrically separated from the conductive patterns, and exposed outwardly from the ceramic main body.
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Abstract
There are provided a multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength, and a fabrication method thereof. Dummy electrodes connected to the outer electrodes are formed on cover areas and an active area of a ceramic main body. A multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength can be obtained.
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Citations
31 Claims
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1. A multilayered ceramic electronic component comprising:
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a ceramic main body including outer electrodes formed thereon; conductive patterns laminated within the ceramic main body; and first dummy patterns disposed on cover areas of the ceramic main body, electrically separated from the conductive patterns, and exposed outwardly from the ceramic main body. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of fabricating a multilayered ceramic electronic component, the method comprising:
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forming a first dummy pattern on a ceramic green sheet to prepare a first ceramic green sheet; forming a conductive pattern and a second dummy pattern on another ceramic green sheet to prepare a second ceramic green sheet; laminating the first and second green sheets to prepare a laminate; cutting the laminate such that the first and second dummy patterns are exposed to the outside, and firing the cut laminate; and forming outer electrodes on the fired laminate. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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Specification