LED BACKLIGHT DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE
First Claim
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1. An LED backlight device, comprising:
- an LED package provided with an LED chip as a light source, a submount substrate on which the LED chip is mounted, and a sealing resin which seals the LED chip;
an LED mounting member where a wiring pattern for driving the LED chip is formed and a predetermined number of LED packages are mounted as the LED package; and
a heat dissipating member having a plurality of LED mounting members mounted thereon as the LED mounting member, and dissipating heat generated by the LED chip when driven,the LED backlight device irradiating a liquid crystal panel with light emitted by a plurality of LED packages disposed behind the liquid crystal panel as the LED package,whereina heat dissipating substrate is provided on which the plurality of LED packages are integrally mounted at a predetermined pitch, the heat dissipating substrate has a wiring pattern formed thereon for driving the LED chip, the submount substrate of each of the LED packages is mounted on the wiring pattern such that the LED packages are mounted directly on the heat dissipating substrate, and the heat dissipating substrate serves both as the LED mounting member and as the heat dissipating member.
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Abstract
Disclosed are a direct LED backlight device and a liquid crystal display device, which is provided with the backlight device. In the LED backlight device (BL1), cost is reduced by simplifying an assembly step with the reduced number of components that constitute the backlight device, and even with the reduced number of components, the service life of an LED package can be stabilized by dissipating heat. A wiring pattern (2) for driving an LED chip is provided on a heat dissipating board (4), and an LED package (1) is directly mounted on the heat dissipating board (4) by mounting, on the wiring pattern (2), each sub-mounting board having the LED chip mounted thereon.
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Citations
8 Claims
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1. An LED backlight device, comprising:
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an LED package provided with an LED chip as a light source, a submount substrate on which the LED chip is mounted, and a sealing resin which seals the LED chip; an LED mounting member where a wiring pattern for driving the LED chip is formed and a predetermined number of LED packages are mounted as the LED package; and a heat dissipating member having a plurality of LED mounting members mounted thereon as the LED mounting member, and dissipating heat generated by the LED chip when driven, the LED backlight device irradiating a liquid crystal panel with light emitted by a plurality of LED packages disposed behind the liquid crystal panel as the LED package, wherein a heat dissipating substrate is provided on which the plurality of LED packages are integrally mounted at a predetermined pitch, the heat dissipating substrate has a wiring pattern formed thereon for driving the LED chip, the submount substrate of each of the LED packages is mounted on the wiring pattern such that the LED packages are mounted directly on the heat dissipating substrate, and the heat dissipating substrate serves both as the LED mounting member and as the heat dissipating member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification
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Current AssigneeSharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
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Original AssigneeSharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
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InventorsKamada, Kentaro
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Application NumberUS13/806,161Publication NumberTime in Patent OfficeDaysField of SearchUS Class Current362/97.3CPC Class CodesG02F 1/133603 with LEDsG02F 1/133608 including particular frames...G02F 1/133612 Electrical detailsG02F 1/133628 with cooling means
