MICROBATTERY AND METHOD FOR MANUFACTURING A MICROBATTERY

• US 20130095381A1
• Filed: 05/31/2011
• Published: 04/18/2013
• Est. Priority Date: 06/21/2010
• Status: Active Grant

• Current Assignee: Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission)
• Original Assignee: Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission)
• Inventors: Oukassi, Sami, Dunoyer, Nicolas, Salot, Raphael
• Granted Patent: US 9,312,561 B2
• Time in Patent Office: Days
• US Class Current: 429/209
• CPC Class Codes: H01M 10/0436 Small-sized flat cells or batteries for portable equipment
• CPC Class Codes: H01M 10/052 Li-accumulators
• CPC Class Codes: H01M 10/0562 Solid materials
• CPC Class Codes: H01M 10/0585 of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• CPC Class Codes: H01M 4/0404 by coating on electrode collectors
• CPC Class Codes: H01M 4/0471 involving thermal treatment, e.g. firing, sintering, backing particulate active material, thermal decomposition, pyrolysis
• CPC Class Codes: H01M 4/38 of elements or alloys
• CPC Class Codes: H01M 4/485 of mixed oxides or hydroxides for inserting or intercalating light metals, e.g. LiTi2O4 or LiTi2OxFy H01M4/505, H01M4/525 take precedence
• CPC Class Codes: H01M 4/505 of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
• CPC Class Codes: H01M 4/525 of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
• CPC Class Codes: H01M 4/5805 Phosphides
• CPC Class Codes: H01M 4/5815 Sulfides
• CPC Class Codes: H01M 4/661 Metal or alloys, e.g. alloy coatings H01M4/669 take precedence
• CPC Class Codes: H01M 4/662 Alloys collectors of lead alloys H01M4/685
• CPC Class Codes: H01M 4/667 in the form of layers, e.g. coatings
• CPC Class Codes: H01M 6/40 Printed batteries , e.g. thin film batteries
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49108 Electric battery cell making
• CPC Class Codes: Y10T 29/4911 including sealing
• CPC Class Codes: Y10T 29/49115 : including coating or impregnating
• CPC Class Codes: Y10T 29/49213 : Metal

Abstract

A microbattery that includes, in succession starting from a first substrate: a first current collector, a first electrode, an electrolyte, a second electrode consisting of a solder joint, a second current collector and a second substrate. Additionally, a method for manufacturing a microbattery, which includes the following steps: forming a thin-film multilayer including, in succession from the first substrate, a first current collector, a first electrode, an electrolyte and a first metal film; forming a second current collector on a face of a second substrate; and forming a second electrode by soldering the first metal film and the second current collector together, said substrates being placed facing each other during assembly.

Claims

1-14. -14. (canceled)

15. A microbattery comprising an assembly of thin films successively forming, starting from a first substrate, a first current collector, a first electrode, an electrolyte, a second electrode, a second current collector, and a second substrate, wherein the second electrode is formed by a brazed joint and is configured to mechanically connect the first substrate with the second substrate.

16. The microbattery according to claim 15, wherein the second substrate comprises at least one electronic component.

17. A method for manufacturing a microbattery comprising the following steps of:

forming a stack of thin films on a first substrate comprising, successively, starting from the first substrate, a first current collector, a first electrode, an electrolyte, and a first metal film,

forming a second current collector on a face of a second substrate, and

forming a second electrode, said step of forming the second electrode comprising an assembly step of said first and second substrates by soldering the first metal film and the second current collector together using at least one solder ball previously deposited on a contact face of the first metal film or on a contact face of the second current collector, said first and second substrates being placed facing each other during the assembly step.

18. The method according to claim 17, wherein the second current collector comprises a second metal film, said second metal film forming the contact face of the second current collector.

19. The method according to claim 17, wherein the second electrode is formed during the assembly step by remelting the solder ball.

20. The method according to claim 17, wherein the second electrode is made of at least one intermetallic compound resulting from the interdiffusion of metallic species from the solder ball and from the first metal film.

21. The method according to claim 17, wherein the solder ball is partially consumed during said soldering so as to form the second electrode and an electrically conductive film between the second current collector and the second electrode, said electrically conductive film being made of the material forming the solder ball.

22. The method according to claim 17, wherein the solder ball is made of an electrically conductive material selected from among alloys of tin, silver, indium, gold and/or copper.

23. The method according to claim 22, wherein the solder ball is made of an electrically conductive material selected from among SnAgCu, AuSn, AgIn, and SnCu alloys.

24. The method according to claim 17, wherein the first metal film is made of a metal selected from among copper, tin, and a copper-tin alloy.

25. The method according to claim 17, wherein the first metal film is made of a stack of metal-based films and wherein one of said metal-based films is provided with the contact face intended to be in contact with the solder ball and is made of a metal selected from among copper, tin, and a copper-tin alloy.

26. The method according to claim 24, wherein the assembly of the first and second substrates comprises placing the solder ball in contact with the first metal film and remelting the solder ball by thermal treatment.

27. The method according to claim 17, wherein the first metal film is made of copper and the solder ball is made of an SnAgCu alloy and in that the thermal treatment is carried out at a temperature ranging between 170°

C. and 260°

C.

28. The method according to claim 17, wherein the second substrate comprises at least one electronic component.

29. The method according to claim 17, wherein the step of forming the second electrode is followed by a step of encapsulation of the microbattery.