Please download the dossier by clicking on the dossier button x
×

Device and Method for Manufacturing a Device

  • US 20130095609A1
  • Filed: 12/07/2012
  • Published: 04/18/2013
  • Est. Priority Date: 04/01/2010
  • Status: Active Grant
First Claim
Patent Images

1. A method for manufacturing a device, the method comprising:

  • encapsulating a first semiconductor chip with a first encapsulant, wherein the first encapsulant comprises a cavity;

    mounting an electrical component on a carrier; and

    placing the carrier on a first main surface of the encapsulant such that the electrical component is enclosed by the cavity.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×