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Package for an Implantable Device

  • US 20130096661A1
  • Filed: 12/07/2012
  • Published: 04/18/2013
  • Est. Priority Date: 03/24/1999
  • Status: Active Grant
First Claim
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1. An implantable device, comprising:

  • an electrically non-conductive substrate;

    a plurality of electrically conductive feedthroughs through the electrically non-conductive substrate and substantially flush with an exterior surface of the electrically non-conductive substrate;

    a circuit attached to an interior surface of the electrically non-conductive substrate; and

    a cover bonded to the electrically non-conductive substrate, the cover, the electrically non-conductive substrate and the electrically conductive feedthroughs forming a hermetic package.

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