Package for an Implantable Device
First Claim
Patent Images
1. An implantable device, comprising:
- an electrically non-conductive substrate;
a plurality of electrically conductive feedthroughs through the electrically non-conductive substrate and substantially flush with an exterior surface of the electrically non-conductive substrate;
a circuit attached to an interior surface of the electrically non-conductive substrate; and
a cover bonded to the electrically non-conductive substrate, the cover, the electrically non-conductive substrate and the electrically conductive feedthroughs forming a hermetic package.
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Abstract
The present invention is an implantable electronic device formed within a biocompatible hermetic package. Preferably the implantable electronic device is used for a visual prosthesis for the restoration of sight in patients with lost or degraded visual function. The package is formed from a thin film of hermetic biocompatible material to minimize the size of the implanted device.
19 Citations
15 Claims
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1. An implantable device, comprising:
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an electrically non-conductive substrate; a plurality of electrically conductive feedthroughs through the electrically non-conductive substrate and substantially flush with an exterior surface of the electrically non-conductive substrate; a circuit attached to an interior surface of the electrically non-conductive substrate; and a cover bonded to the electrically non-conductive substrate, the cover, the electrically non-conductive substrate and the electrically conductive feedthroughs forming a hermetic package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification