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METHOD AND DEVICE FOR HEATING ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS USING THE SAME

  • US 20130098891A1
  • Filed: 01/14/2012
  • Published: 04/25/2013
  • Est. Priority Date: 10/21/2011
  • Status: Active Grant
First Claim
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1. A method for heating an electronic component in a low-temperature environment, wherein a first heater is disposed at the electronic component, the method comprising:

  • driving the first heater according to a duty ratio to use electrical energy of a power module;

    setting the duty ratio as a first ratio if an output voltage of the power module is greater than a first threshold;

    setting the duty ratio as a second ratio if the output voltage of the power module is less than a second threshold, wherein the second threshold is less than the first threshold and greater than zero, and the second ratio is less than the first ratio; and

    adjusting the duty ratio so that the difference between the output voltage of the power module and the second threshold is positively proportional to the duty ratio if the output voltage of the power module is between the first threshold and the second threshold.

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