MULTILAYERED CIRCUIT TYPE ANTENNA PACKAGE
First Claim
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1. A multilayered antenna package comprising:
- a radio frequency integrated circuit (RFIC) interface layer that is configured to transmit a radio frequency (RF) signal;
a first dielectric layer that is disposed on the RFIC interface layer;
a coplanar waveguide layer that is disposed on the first dielectric layer and is configured to receive the RF signal transmitted by RFIC layer;
a second dielectric layer disposed on the coplanar waveguide layer; and
an antenna portion that is disposed on the second dielectric layer and is configured to irradiate a signal that is transmitted from the coplanar waveguide layer.
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Abstract
A multilayered antenna package including: a radio frequency integrated circuit (RFIC) interface layer that is configured to transmit a radio frequency (RF) signal; a first dielectric layer that is disposed on the RFIC interface layer; a coplanar waveguide layer that is disposed on the first dielectric layer and is configured to receive the RF signal transmitted by RFIC layer; a second dielectric layer disposed on the coplanar waveguide layer; and an antenna portion that is disposed on the second dielectric layer and is configured to irradiate a signal that is transmitted from the coplanar waveguide layer.
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Citations
19 Claims
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1. A multilayered antenna package comprising:
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a radio frequency integrated circuit (RFIC) interface layer that is configured to transmit a radio frequency (RF) signal; a first dielectric layer that is disposed on the RFIC interface layer; a coplanar waveguide layer that is disposed on the first dielectric layer and is configured to receive the RF signal transmitted by RFIC layer; a second dielectric layer disposed on the coplanar waveguide layer; and an antenna portion that is disposed on the second dielectric layer and is configured to irradiate a signal that is transmitted from the coplanar waveguide layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A multilayered antenna package comprising:
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a first dielectric layer; a coplanar waveguide layer disposed directly on an upper surface of the first dielectric layer; a radio frequency integrated circuit (RFIC) interface layer that is disposed directly on a lower surface of the first dielectric layer; at least one first connection via that electrically connects the RFIC interface layer to the coplanar waveguide layer through the first dielectric layer; a second dielectric layer disposed directly on an upper surface of the coplanar waveguide layer; an antenna portion that is disposed directly on an upper surface of the second dielectric layer; and at least one second connection via that electrically connects the coplanar waveguide layer to the antenna portion through the second dielectric layer. - View Dependent Claims (18, 19)
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Specification