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MULTILAYERED CIRCUIT TYPE ANTENNA PACKAGE

  • US 20130099389A1
  • Filed: 06/22/2012
  • Published: 04/25/2013
  • Est. Priority Date: 10/19/2011
  • Status: Active Grant
First Claim
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1. A multilayered antenna package comprising:

  • a radio frequency integrated circuit (RFIC) interface layer that is configured to transmit a radio frequency (RF) signal;

    a first dielectric layer that is disposed on the RFIC interface layer;

    a coplanar waveguide layer that is disposed on the first dielectric layer and is configured to receive the RF signal transmitted by RFIC layer;

    a second dielectric layer disposed on the coplanar waveguide layer; and

    an antenna portion that is disposed on the second dielectric layer and is configured to irradiate a signal that is transmitted from the coplanar waveguide layer.

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