VIA STRUCTURES AND COMPACT THREE-DIMENSIONAL FILTERS WITH THE EXTENDED LOW NOISE OUT-OF-BAND AREA

• US 20130099876A1
• Filed: 06/30/2010
• Published: 04/25/2013
• Est. Priority Date: 06/30/2010
• Status: Active Grant

• Current Assignee: NEC Corporation
• Original Assignee: NEC Corporation
• Inventors: Kushta, Taras
• Granted Patent: US 9,362,603 B2
• Time in Patent Office: Days
• US Class Current: 333/134
• CPC Class Codes: H01P 1/20 Frequency-selective devices, e.g. filters
• CPC Class Codes: H01P 1/203 Strip line filters
• CPC Class Codes: H05K 1/0222 for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
• CPC Class Codes: H05K 1/0233 Filters, inductors or a magnetic substance
• CPC Class Codes: H05K 1/0251 related to vias or transitions between vias and transmission lines
• CPC Class Codes: H05K 2201/09609 Via grid, i.e. two-dimensional array of vias or holes in a single plane interposers H05K2201/10378
• CPC Class Codes: H05K 2201/09618 Via fence, i.e. one-dimensional array of vias
• CPC Class Codes: H05K 2201/0979 Redundant conductors or connections, i.e. more than one current path between two points
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/4614 the electrical connections between the circuit boards being made during lamination

Abstract

A filter of the present invention includes a plurality of via structures with a multilayer substrate. Each of the plurality of via structures includes first, second and third functional sections. One end of a signal via of the first functional section is connected to one end of a signal via of the second functional section and another end of the signal via of the second functional section is connected to two signal vias of the third functional section. Those signal vias are surrounded by a plurality of ground vias. Input and output ports of the filter are connected to another end of the signal via of each first functional section.

Claims

1. A filter comprising:

a plurality of via structures;

a transmission line configured to connect said plurality of via structures; and

a plurality of signal ports configured to input or output signals,

wherein each of said plurality of via structures comprises;

a multilayer substrate with a plurality of stacked conductor layers and a dielectric isolating each of said plurality of stacked conductor layers;

a first functional section disposed at one side of said multilayer substrate;

a second functional section connected to said first functional section; and

a third functional section connected to said second functional section and disposed at a side of said multilayer substrate opposite to said side of said first functional section,

wherein said first functional section comprises;

a first pad embedded in a top conductor layer of said plurality of stacked conductor layers;

a connection pad embedded in one of said plurality of conductor layers and configured to connect to said second functional section;

a first signal via with one end connected to said first pad and another end connected to said connection pad;

a first plurality of ground vias surrounding said first signal via;

a first plurality of ground plates embedded in said plurality of conductor layers and connected to said first plurality of ground vias; and

a first clearance region embedded in said dielectric configured to isolate said first pad, said connection pad and said first signal via from said first plurality of ground vias and said first plurality of ground plates,

wherein said second functional section comprises;

a connection plate embedded in one of said plurality of conductor layers and configured to connect to said third functional section;

a second signal via with one end connected to said connection pad and another end connected to said connection plate;

a second plurality of ground vias surrounding said second signal via;

a second plurality of ground planes embedded in said plurality of conductor layers and connected to said second plurality of ground vias; and

a second clearance region embedded in said dielectric and configured to isolate said connection plate and said second signal via from said second plurality of ground vias and said second plurality of ground planes,

wherein said third functional section comprises;

two identical third signal vias connected to said connection plate by one end;

two identical sets of conductive plates respectively connected to said two identical signal vias;

a third plurality of ground vias surrounding said two identical signal vias;

a third plurality of ground planes connected to said third plurality of ground vias; and

a third clearance region embedded in said dielectric and configured to isolate said two identical third signal vias and two identical sets of conductive plates from said third plurality of ground vias and said third plurality of ground planes,

wherein said transmission line is connected to said connection pad of said each via structure,

wherein said plurality of signal ports are connected to or embedded in said first pad of said each via structure.

2. The filter according to claim 1 wherein said second clearance region comprises an isolating slit configured to isolate said connection plate and one of said second plurality of ground plates disposed in a same layer of said multilayer substrate,

wherein said third clearance region comprises an isolating slit configured to isolate each conductive plate of said two identical sets of conductive plates and each of said third plurality of ground planes disposed in a same layer of said multilayer substrate.

3. The filter according to claim 2 wherein said third functional section further comprises:

two identical border plates embedded in a last layer of said plurality of stacked conductor layers and connected to said two identical third signal vias respectively by another end; and

an isolating slit isolating said two identical border plates and one of said plurality of third ground planes disposed in a same layer of said multilayer substrate.

4. The filter according to claim 2 wherein said two identical third signal vias are connected by another end to one of said plurality of third ground planes disposed in a last layer of said plurality of stacked conductor layers.

5. The filter according to claim 3 wherein said second functional section further comprises a plurality of conductive plates connected to said second via and isolated from said second plurality of ground vias and said second plurality of ground planes by said second clearance region.

6. The filter according to claim 4, wherein said second functional section further comprises a plurality of conductive plates connected to said second via and isolated from said second plurality of ground vias and said second plurality of ground planes by said second clearance region.

7. The via structure according to claim 1.

8. The via structure according to claim 2.

9. The via structure according to claim 3.

10. The via structure according to claim 4.

11. The via structure according to claim 5.

12. The via structure according to claim 6.