×

MICROMECHANICAL COMPONENT AND METHOD FOR MANUFACTURING A MICROMECHANICAL COMPONENT

  • US 20130104654A1
  • Filed: 10/24/2012
  • Published: 05/02/2013
  • Est. Priority Date: 10/27/2011
  • Status: Active Grant
First Claim
Patent Images

1. A micromechanical component, comprising:

  • a substrate;

    a seismic weight joined to the substrate at a first suspension mount;

    at least one first electrode for measuring a motion of the seismic weight in a first direction, the first electrode being joined to the substrate at a second suspension mount; and

    at least one second electrode for measuring a motion of the seismic weight in a second direction different from the first direction, the second electrode being joined to the substrate at a third suspension mount;

    wherein the first electrode is set apart from the second suspension mount and mechanically connected to the second suspension mount with the aid of a support arm.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×