PUDDLE FORMING AND SHAPING WITH PRIMARY AND SECONDARY LASERS

• US 20130105447A1
• Filed: 10/26/2012
• Published: 05/02/2013
• Est. Priority Date: 10/26/2011
• Status: Active Grant

• Current Assignee: Titanova, Inc.
• Original Assignee: Titanova, Inc.
• Inventors: Haake, John M.
• Granted Patent: US 10,201,877 B2
• Time in Patent Office: Days
• US Class Current: 219/76.14
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/144 the fluid stream containing particles, e.g. powder
• CPC Class Codes: B23K 26/32 taking account of the properties of the material involved
• CPC Class Codes: B23K 26/34 Laser welding for purposes other than joining
• CPC Class Codes: B23K 26/342 Build-up welding
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B33Y 30/00 Apparatus for additive manufacturing; Details thereof or accessories therefor

Abstract

A material processing system for a base material is provided. The system includes a feeder having a distal end proximate to a surface location of the base material. The feeder supplies a deposit material to the surface location. The deposit material has a width having a first side and a second side. A first laser is directed to the deposit material at the surface location. The first laser is directed across the width from the first side to the second side. A second laser is directed to a desired location within the width. A control system drives the process of cladding the deposit material. The control system includes a shape controller to control the movement of the secondary laser along the deposit material based on feedback from a sensor.

Claims

1. A material processing system for a base material comprising:

a feeder having a distal end proximate to a surface location of the base material, wherein said feeder supplies a deposit material to said surface location, said deposit material having a width having a first side and a second side;

a first laser directed to said deposit material at said surface location, wherein said first laser is directed across said width from said first side to said second side; and

a second laser directed to a desired location within said width.

2. The invention of claim 1, wherein said deposit material is comprised of a powder, wire or strip, wherein said first laser is comprised of a line source diode laser having a first power level, and wherein a second power level of said second laser is less than approximately one fourth of said first power level.

3. The invention of claim 1 further comprising a sensor and a shape controller, said shape controller connected to said second laser, wherein said sensor monitors the deposit material and said shape controller positions said second laser relative to said first side and said second side based on feedback from said sensor.

4. The invention of claim 1, wherein said first laser melts said deposit material and said second laser moves said melted deposit material.

5. The invention of claim 1, wherein a beam from said second laser is positioned at least one of before, within, or beyond a beam from said first laser.

6. The invention of claim 1, wherein a beam spot diameter of a beam from said second laser is less than approximately one half a width of a beam from said first laser.

7. The invention of claim 1, wherein said first laser includes first optics and said second laser includes second optics, said first optics separate from said second optics.

8. A material processing system for a base material comprising:

a material feed location;

a first laser having a line source beam aimed toward said material feed location, wherein said first laser has a first power level and said line source beam has a first side and a second side; and

a second laser directed to a selected location between said first side and said second side, wherein the selected location is inclusive of the first side and the second side, wherein said second laser has a second power level less than approximately one fourth of said first power level.

9. The invention of claim 8 further comprising a sensor and a shape controller, said shape controller connected to said second laser, wherein said sensor monitors the deposit material and said shape controller positions said second laser relative to said first side and said second side based on feedback from said sensor.

10. The invention of claim 8, wherein said first laser melts a deposit material disposed on said feed location and said second laser moves said melted deposit material.

11. The invention of claim 8, wherein a beam from said second laser is positioned at least one of before, within, or beyond a beam from said first laser.

12. The invention of claim 8, wherein a beam spot diameter of a beam from said second laser is less than approximately one half a width of a beam from said first laser.

13. The invention of claim 8, wherein said first laser includes primary optics and said second laser includes second optics, said first optics separate from said second optics.

14. A method for processing a base material comprising the steps of:

directing a deposit material through a feeder to a surface location proximate to the base material, wherein the deposit material directed by the feeder has a width with a first side and a second side;

aiming a first laser at the deposit material at the surface location, wherein the first laser comprises a beam width extending substantially across the first side to the second side; and

aiming a second laser toward a selected location between said first side and said second side, wherein the selected location is inclusive of the first side and the second side.

15. The method of claim 14, wherein directing a deposit material through a feeder further comprises directing the deposit material from at least one of a wire feed or a hot wire feed.

16. The method of claim 14, wherein the second laser has a power level less than approximately one fourth of a power level of the first laser.

17. The method of claim 14 further comprising:

monitoring the deposit material with a sensor; and

positioning the second laser at the selected location based on feedback from the sensor.

18. The method of claim 17 further comprising positioning a beam from the second laser at least one of before, within, or beyond a beam from the first laser.

19. The method of claim 14 further comprising melting the deposit material with the first laser and moving the melted deposit material with the second laser.

20. The method of claim 14, wherein a beam spot diameter of a beam from the second laser is less than approximately one half a width of a beam from the first laser.