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MICROSYSTEM DEVICE AND METHODS FOR FABRICATING THE SAME

  • US 20130105921A1
  • Filed: 10/31/2012
  • Published: 05/02/2013
  • Est. Priority Date: 10/31/2011
  • Status: Active Grant
First Claim
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1. A microsystem, comprising:

  • a package base layer formed from a first substrate of an electrical insulating material, the package base layer having;

    a base inner surface defining a base cavity; and

    a base external surface opposed to the base inner surface, and in direct communication with an environment;

    a cap layer formed from a second substrate of the electrical insulating material or of an other electrical insulating material, the cap layer having;

    a cap inner surface defining a cap cavity; and

    a cap external surface opposed to the cap inner surface, and in direct communication with the environment; and

    a microelectromechanical (MEMS) device layer having a device layer substrate disposed between the package base layer and the cap layer, wherein respective adjacent portions of the package base layer, the cap layer and the device layer substrate are bonded to define an enclosed space between the package base layer and the cap layer, the enclosed space at least partially including the base cavity or the cap cavity;

    wherein at least an operative portion of a MEMS device on or in the MEMS device layer is disposed in the enclosed space;

    and wherein the MEMS device layer is formed from a substrate of the electrical insulating material or of an other electrical insulating material.

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