×

Semiconductor Device

  • US 20130105964A1
  • Filed: 10/26/2012
  • Published: 05/02/2013
  • Est. Priority Date: 10/31/2011
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor device comprising:

  • a wiring substrate;

    a semiconductor element mounted on the wiring substrate;

    a first radiator member arranged on the semiconductor element and thermally coupled to the semiconductor element; and

    a second radiator member arranged on the first radiator member and thermally coupled to the first radiator member;

    whereinthe second radiator member includes a plurality of projections which project out toward the first radiator member, the plurality of projections being formed on a circumference of a concentric circle with respect to a center point of the second radiator member when the second radiator member is viewed from above;

    the first radiator member includes a plurality of grooves in which the plurality of projections are movable, the plurality of grooves being formed on a circumference of a concentric circle with respect to a center point of the first radiator member when the first radiator member is viewed from above, each of the plurality of grooves including a terminating end; and

    each of the plurality of projections is fitted to the terminating end of a corresponding one of the plurality of grooves with the center point of the first radiator member and the center point of the second radiator member coincided.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×