ELECTRONIC DEVICE PACKAGES AND METHODS

• US 20130108124A1
• Filed: 10/23/2012
• Published: 05/02/2013
• Est. Priority Date: 10/27/2011
• Status: Active Grant

• Current Assignee: Synaptics Incorporated
• Original Assignee: Synaptics Incorporated
• Inventors: Wickboldt, Paul, Thammasouk, Khamvong
• Granted Patent: US 10,043,052 B2
• Time in Patent Office: Days
• US Class Current: 382/124
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

Electronic devices are described which are adapted and configured to incorporate a fingerprint sensor within a recess or aperture, formed or molded in the housing, such that the fingerprint sensor interface is within 500 microns of an exterior surface of the device. Methods of use and manufacture are also described.

Claims

1. An electronic device housing comprising:

an upper surface, a lower surface and side surfaces between the upper surface and the lower surface such that the upper, lower and side surfaces integrally form the electronic device housing and define a cavity within the housing and an exterior surface of the housing; and

a fingerprint sensor region integrally formed within the housing, wherein the fingerprint sensor region comprises at least one of a recess, alcove, depression, aperture, gap, opening and space within an opening facing an interior of the housing, wherein the recess is sized to receive a fingerprint sensor therein, and further wherein a sensing portion of the fingerprint sensor is positionable within the fingerprint sensor region at a location within 500 microns of an exterior surface of the housing at the fingerprint sensor region and an integrated circuit positionable within the housing in communication with the fingerprint sensor.

2. The electronic device housing according to claim 1 wherein the electronic device has a display screen interface.

3. The electronic device housing according to claim 2 wherein the display screen interface is all or a portion of one of the surfaces of the housing.

4. The electronic device housing according to claim 2 wherein the display screen interface comprises a touch screen sensor.

5. The electronic device housing according to claim 2 wherein the display screen interface presents a visual display.

6. The electronic device housing according to claim 2 wherein the fingerprint sensor region is incorporated into the display screen interface.

7. The electronic device housing according to claim 2 further comprising a cover lens.

8. The electronic device housing according to claim 1 wherein the electronic device has one or more button interfaces.

9. The electronic device housing according to claim 1 wherein a support material is moldable within the recess of the fingerprint sensor region formed within the housing.

10. The electronic device housing according to claim 1 wherein the housing further comprises a bezel.

11. The electronic device housing according to claim 1 wherein the fingerprint sensing region has a concave or convex exterior feature adapted to provide a tactile indication of the location of the fingerprint sensing elements.

12. The electronic device housing according to claim 1 wherein the fingerprint sensor region is molded therein.

13. The electronic device housing according to claim 1 wherein the integrated circuit is positioned within the at least one of a recess, alcove, depression, aperture, gap, opening and space accessible from an interior surface of the housing.

14. A method of using an electronic device having an upper surface, a lower surface and side surfaces between the upper surface and the lower surface such that the upper, lower and side surfaces integrally form the electronic device housing and define a cavity within the housing and an exterior surface of the housing;

and a fingerprint sensor region integrally formed within the housing, wherein the fingerprint sensor region comprises at least one of a recess, alcove, depression, aperture, gap, opening and space within an opening facing an interior of the housing, wherein the recess is sized to receive a fingerprint sensor therein, and further wherein a sensing portion of the fingerprint sensor is positionable within the fingerprint sensor region at a location within 500 microns of an exterior surface of the housing at the fingerprint sensor region and an integrated circuit positionable within the housing in communication with the fingerprint sensor, comprising;

at least one of placing or swiping a finger of a user on an exterior surface of the electronic device housing proximate the fingerprint sensor positioned within the housing;

obtaining fingerprint information from the finger;

validating the fingerprint information obtained; and

at least one of enabling and disabling functionality of the electronic device in response to the step of validating.

15. The method of claim 14 wherein the fingerprint information obtained is one of 1D and 2D fingerprint information.

16. The method of claim 14 wherein the step of validating further comprises at least one of successfully validating the fingerprint information, and failing to successfully validate the fingerprint information.

17. The method of claim 14 wherein the step of enabling functionality further comprises enabling one or more of unlocking a user interface, accessing an internet connection, accessing one or more electronic files, accessing one or more resident applications, accessing a camera, accessing an electronic accessory, and accessing an email account.

18. The method of claim 14 wherein the step of disabling functionality further comprises disabling one or more of unlocking a user interface, accessing an internet connection, accessing one or more electronic files, accessing one or more resident applications, accessing a camera, accessing an electronic accessory, and accessing an email account.

19. A method of manufacturing an electronic device having a housing with an upper surface, a lower surface and side surfaces between the upper surface and the lower surface such that the upper, lower and side surfaces integrally form the electronic device housing and define a cavity within the housing and an exterior surface of the housing;

and a fingerprint sensor region integrally formed within the housing, wherein the fingerprint sensor region comprises at least one of a recess, alcove, depression, aperture, gap, opening and space within an opening facing an interior of the housing, wherein the recess is sized to receive a fingerprint sensor therein, and further wherein a sensing portion of the fingerprint sensor is positionable within the fingerprint sensor region at a location within 500 microns of an exterior surface of the housing at the fingerprint sensor region and an integrated circuit positionable within the housing in communication with the fingerprint sensor, comprising the steps of;

casting a housing, wherein the step of casting further comprises at least one of casting the housing with a recess or aperture sized to accommodate the sensor, and machining a recess or aperture into the housing;

positioning a sensor in the recess or aperture within 500 um of the exterior surface;

routing sensor traces away from the sensor and toward the integrated circuit; and

positioning the integrated circuit within the housing.

20. The method of manufacturing an electronic device according to claim 19 wherein the electronic device has a display screen interface.

21. The method of manufacturing an electronic device according to claim 20 wherein the display screen interface is one of the surfaces of the housing.

22. The method of manufacturing an electronic device according to claim 19 wherein the display screen interface comprises a touch screen sensor.

23. The method of manufacturing an electronic device according to claim 19 wherein the display screen interface presents a visual display.

24. The method of manufacturing an electronic device according to claim 19 wherein the fingerprint sensor region is incorporated into the display screen interface.

25. The method of manufacturing an electronic device according to claim 19 further comprising the step of adhering a cover lens to at least a portion of the exterior surface.

26. The method of manufacturing an electronic device according to claim 19 wherein the electronic device has one or more button interfaces.

27. The method of manufacturing an electronic device according to claim 19 further comprising the step of molding a support material within the recess of the fingerprint sensor region.

28. The method of manufacturing an electronic device according to claim 19 wherein the electronic device further comprises a bezel.

29. The method of manufacturing an electronic device according to claim 19 further comprising the step of forming a tactile indicator of the location of the fingerprint sensing elements on the external surface.

30. The method of manufacturing an electronic device according to claim 19 further comprising the step of applying a second layer to the exterior of the housing, wherein the second layer increases one or more of hardness, smoothness, fingerprint resistance, and smudge resistance.