BROAD-AREA LIGHTING SYSTEMS

• US 20130111744A1
• Filed: 12/03/2012
• Published: 05/09/2013
• Est. Priority Date: 09/07/2011
• Status: Abandoned Application

• Current Assignee: Cooledge Lighting Inc.
• Original Assignee: Cooledge Lighting Inc.
• Inventors: Tischler, Michael A., Schick, Philippe M., Sheen, Calvin Wade
• Application Number:
  US13/692,129
• Publication Number:
  US 20130111744A1
• Time in Patent Office: Days
• US Class Current: 29/832
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/6834 used to protect an active side of a device or wafer
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/24101 Connecting bonding areas at the same height
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/245 Material
• CPC Class Codes: H01L 2224/24992 Flow barrier
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32238 the layer connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
• CPC Class Codes: H01L 2224/82104 using screen printing
• CPC Class Codes: H01L 2224/82105 by using a preform
• CPC Class Codes: H01L 2224/82138 the guiding structures being at least partially left in the finished device
• CPC Class Codes: H01L 2224/82855 Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 2224/83424 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/83439 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/83444 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/83447 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/83486 : with a principal constituent of the material being a non metallic, non metalloid inorganic material
• CPC Class Codes: H01L 2224/96 : the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/053 : Oxides composed of metals from groups of the periodic table
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/07811 : Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 33/08 : with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/44 : characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/48 : characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/50 : Wavelength conversion elements
• CPC Class Codes: H05K 13/00 : Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 3/32 : electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/321 : by conductive adhesives
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

In accordance with certain embodiments, illumination systems are formed by aligning light-emitting elements with optical elements and/or disposing light-conversion materials on the light-emitting elements, as well as by providing electrical connectivity to the light-emitting elements

Claims

1. A method of forming an illumination system, the method comprising:

reversibly attaching a light-emitting element to a first substrate;

mating the first substrate to a second substrate to transfer the light-emitting element to the second substrate;

removing the first substrate from the second substrate; and

forming at least two conductors over the light-emitting element and the second substrate to thereby facilitate electrical connectivity to the light-emitting element.

2. The method of claim 1, wherein (i) the light-emitting element has at least two contacts disposed on a first side, and (ii) the first side of the light-emitting element is reversibly attached to the first substrate.

10. The method of claim 1, wherein (i) the second substrate comprises a light-conversion material and (ii) the light-conversion material comprises a phosphor and a binder.

22. The method of claim 1, wherein (i) the light-emitting element comprises two contacts on a single side thereof, and (ii) the second substrate comprises electrical traces thereon prior to being mated to the first substrate, the light-emitting element being transferred to the second substrate between two of the electrical traces, and each of the conductors electrically connecting a contact with an electrical trace.

23. The method of claim 22, wherein the light-emitting element is electrically coupled to the electrical traces with a conductive adhesive.

26. The method of claim 1, wherein the second substrate comprises an optical element associated with the light-emitting element.

28. The method of claim 26, wherein the second substrate comprises a well aligned with the optical element.

30. The method of claim 1, wherein the light-emitting element comprises a light-emitting diode.

32. The method of claim 1, wherein (i) the light-emitting element has at least two contacts, and (ii) prior to reversibly attaching the light-emitting element to the first substrate, the light-emitting element is partially surrounded with a light-conversion material such that two contacts of the light-emitting element are not fully covered by light-conversion material.

61. The method of claim 1, wherein (i) the second substrate comprises a hole therethrough, and (ii) a light-conversion material is disposed within and at least partially filling the hole in the second substrate, the light-emitting element being disposed at least partially within the hole after being transferred to the second substrate.

3-9. -9. (canceled)

11-21. -21. (canceled)

24-25. -25. (canceled)

27. (canceled)

29. (canceled)

31. (canceled)

33-39. -39. (canceled)

40. A method of forming an illumination system, the method comprising:

partially surrounding each of a plurality of bare-die light-emitting elements with a light-conversion material such that two contacts of each light-emitting element are not fully covered by light-conversion material;

inserting each of the light-emitting elements into a well in an optical substrate; and

forming electrical traces over each light-emitting element and the optical substrate to thereby facilitate electrical connectivity to the light-emitting elements.

41. The method of claim 40, wherein each well in the optical substrate is aligned with an optical element disposed on the optical substrate.

42. The method of claim 40, wherein the two contacts of each light-emitting element are substantially coplanar with a surface of the optical substrate after the light-emitting elements have been inserted into wells.

44. The method of claim 40, wherein each light-emitting element is electrically coupled to the electrical traces with a conductive adhesive.

46. The method of claim 40, further comprising disposing a transparent material between an interior surface of a well and the outer surface of the light-conversion material on the light-emitting element inserted into the well, the transparent material having an index of refraction of at least 1.35.

62. The method of claim 40, wherein each well has an interior-surface shape complementary to a shape of an outer surface of the light-conversion material on the light-emitting element.

63. The method of claim 40, wherein forming electrical traces over each light-emitting element and the optical substrate comprises forming a conductive jumper that electrically couples a contact of the light-emitting element to an electrical trace.

43. (canceled)

45. (canceled)

47. (canceled)

48. A method of forming an illumination system, the method comprising:

attaching a plurality of light-emitting elements to an optical substrate, each light-emitting element being (i) electrically connected to at least two electrical traces on the optical substrate, and (ii) at least partially surrounded by a light-conversion material; and

bonding a support substrate to the optical substrate such that each light-emitting element is disposed within a cavity in the support substrate, an inner surface of each cavity being reflective so as to direct light emitted by the light-emitting element therewithin toward the optical element substantially aligned with the light-emitting element.

49. The method of claim 48, wherein each cavity is substantially parabolic and the light-emitting element therewithin is disposed at a focal point thereof.

50. The method of claim 48, wherein a discrete portion of the light-conversion material is disposed over each light-emitting element after the light-emitting elements are attached to the optical substrate.

51. The method of claim 50, wherein the inner surface of each cavity is reflective to a wavelength of light emitted by the light-conversion material.

52. The method of claim 48, wherein each light-emitting element is electrically coupled to the at least two electrical traces with a conductive adhesive.

53. The method of claim 52, wherein the conductive adhesive comprises an anisotropic conductive adhesive.

64. The method of claim 48, wherein each light-emitting element is substantially aligned with an optical element on the optical substrate.

65. The method of claim 48, wherein a discrete portion of the light-conversion material is disposed over each light-emitting element before the light-emitting elements are attached to the optical substrate.

54-60. -60. (canceled)