Structure for placing electronic device

• US 20130112824A1
• Filed: 11/02/2012
• Published: 05/09/2013
• Est. Priority Date: 11/04/2011
• Status: Abandoned Application

• Current Assignee: Tennrich International Corporation
• Original Assignee: Tennrich International Corporation
• Inventors: CHEN, SHIH-HUI, CHENG, HUA-CHI, LIN, CHIN-TIEN
• Application Number:
  US13/667,173
• Publication Number:
  US 20130112824A1
• Time in Patent Office: Days
• US Class Current: 248/206.2
• CPC Class Codes: F16B 47/00 Suction cups for attaching purposes; Equivalent means using adhesives devices using adhesives, suction or magnetism for hanging or supporting pictures or the like A47G1/17; vacuum work holders B25B11/005; anchoring of ships using suction B63B21/27; suction cups for handling glass B65G49/061; load-engaging elements for cranes using suction means B66C1/02

Abstract

A placing structure is disposed with a main body made of a flexible material and at least one sucking component. The main body is disposed with at least one through hole. Each sucking component can selectively pass through the through hole to fasten on the main body. At least one electronic device can be combined with a power bank through the sucking component, and the electrical connection is formed. Alternatively, at least one expansion module is combined with the electronic device, and the electrical connection is formed to reduce carry volume and increase practicality.

Claims

1. A structure for placing an electronic device, comprising:

a main body made of a flexible material, the main body disposed with at least one through hole, the through hole capable of passing through two corresponding surfaces of the main body; and

at least a sucking component made of a flexible material, the sucking component disposed with a fastening portion and sucking portions extended from two sides of the fastening portion, the sucking component fastened in the through hole through the fastening portion, the sucking portions at two sides respectively appearing the two corresponding surfaces of the main body.

2. The structure for placing an electronic device of claim 1, wherein a surface connection place between the through hole and the main body is formed with a chamfer.

3. The structure for placing an electronic device of claim 2, wherein the chamfer is an arc shape.

4. The structure for placing an electronic device of claim 1, wherein fluorescent particles are added in the main body.

5. The structure for placing an electronic device of claim 1, wherein the structure combines at least one electronic device with a power bank.

6. The structure for placing an electronic device of claim 1, wherein the structure combines at least one expansion module with the electronic device.