Magnetic Sensor Device

• US 20130113474A1
• Filed: 11/04/2011
• Published: 05/09/2013
• Est. Priority Date: 11/04/2011
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Elian, Klaus
• Granted Patent: US 9,121,880 B2
• Time in Patent Office: Days
• US Class Current: 324/244
• CPC Class Codes: G01R 33/0047 Housings or packaging of magnetic sensors packaging of semiconductor devices H01L23/00; Holders
• CPC Class Codes: H01F 1/083 in a bonding agent
• CPC Class Codes: H01F 1/113 in a bonding agent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H10N 50/80 Constructional details
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

A magnetic sensor device includes a magnet configured to generate a bias magnetic field. A plurality of electrical wires extend through the magnet. A magnetic sensor chip is attached to an end face of a first electrical wire of the plurality of electrical wires.

Claims

1. A magnetic sensor device, comprising:

a magnet configured to generate a bias magnetic field;

a plurality of electrical wires; and

a magnetic sensor chip attached to an end face of a first electrical wire of the plurality of electrical wires.

2. The magnetic sensor device according to claim 1, wherein the magnet is comprised of a material composition of a polymer and magnetic particles.

3. The magnetic sensor device according to claim 1, further comprising an encapsulation material encapsulating the magnetic sensor chip.

4. The magnetic sensor device according to claim 3, wherein the encapsulation material also covers end faces of the electrical wires.

5. The magnetic sensor device according to claim 1, wherein the end face of the first electrical wire is oriented perpendicular to a longitudinal axis of a portion of the first electrical wire adjacent to the end face.

6. The magnetic sensor device according to claim 1, wherein a main plane of the magnetic sensor chip is oriented perpendicular to a longitudinal axis of a portion of the first electrical wire adjacent to the end face.

7. The magnetic sensor device according to claim 1, wherein the first electrical wire comprises an end portion formed so as to provide the end face that comprises a surface area that is larger at least along one direction than a cross-sectional area of any other portion of the first electrical wire.

8. The magnetic sensor device according to claim 7, wherein the end portion is formed by forging and/or bending.

9. The magnetic sensor device according to claim 1, wherein the electrical wires are covered by an insulation layer along respective line sections within the magnet.

10. The magnetic sensor device according to claim 1, further comprising one or more capacitors, each capacitor connected between two electrical wires or between the magnetic sensor chip and one electrical wire, respectively.

11. A magnetic sensor device, comprising:

a plurality of electrical wires;

a permanent magnet; and

a magnetic sensor chip disposed on an end face of a first electrical wire of the plurality of electrical wires.

12. The magnetic sensor device according to claim 11, wherein the electrical wires extend through the permanent magnet.

13. The magnetic sensor device according to claim 11, wherein a plane of the magnetic sensor chip is oriented perpendicular to a portion of the first electrical wire adjacent to the end face.

14. The magnetic sensor device according to claim 11, wherein the magnet is comprised of a material composition of a polymer and magnetic particles.

15. A magnetic sensor device, comprising:

a leadframe comprising leadfingers;

a magnetic sensor chip attached to an end face of a first leadfinger; and

a magnet configured to generate a bias magnetic field.

16. The magnetic sensor device according to claim 15, wherein the leadfingers extend through the magnet.

17. The magnetic sensor device according to claim 15, further comprising an encapsulation material encapsulating the magnetic sensor chip.

18. The magnetic sensor device according to claim 17, wherein the encapsulation material also covers end faces of the leadfingers other than the first leadfinger.

19. The magnetic sensor device according to claim 15, wherein the magnet is comprised of a material composition of a polymer and magnetic particles.

20. A method for fabricating a magnetic sensor device, the method comprising:

providing a plurality of electrical wires;

providing a magnet so that the electrical wires extend through the magnet; and

attaching a sensor chip to an end face of a first electrical wire of the plurality of electrical wires.

21. The method according to claim 20, wherein providing the magnet comprises attaching a material composition of a polymer and magnetic or magnetizable particles on or around the electrical wires.

22. The method according to claim 20, further comprising encapsulating the magnetic sensor chip with an encapsulation material.

23. A method for fabricating a magnetic sensor device, the method comprising:

providing a leadframe comprising a plurality of leadfingers;

molding a material composition of a polymer and magnetic or magnetizable particles on or around the leadfingers so that the leadfingers extend through the molded polymer-based material; and

disposing a sensor chip to an end face of a first leadfinger of the plurality of leadfingers.

24. The method according to claim 23, further comprising encapsulating the sensor chip with an encapsulation material.

25. The method according to claim 24, wherein encapsulating the sensor chip comprises covering end faces of the leadfingers other than the first leadfinger with the encapsulation material.