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TRANSPARENT ELECTRODE INTEGRATED ENCAPSULATION MODULE AND MANUFACTURING METHOD THEREOF

  • US 20130115446A1
  • Filed: 12/20/2012
  • Published: 05/09/2013
  • Est. Priority Date: 02/08/2010
  • Status: Abandoned Application
First Claim
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1. A transparent electrode integrated encapsulation module in which a transparent electrode is formed on an encapsulation glass substrate without a separate glass substrate for electrode formation of a touch screen circuit.

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