TRANSPARENT ELECTRODE INTEGRATED ENCAPSULATION MODULE AND MANUFACTURING METHOD THEREOF

• US 20130115446A1
• Filed: 12/20/2012
• Published: 05/09/2013
• Est. Priority Date: 02/08/2010
• Status: Abandoned Application

• Current Assignee: Dongho Kang, Yong-Oon Hwang
• Original Assignee: Dongho Kang, Yong-Oon Hwang
• Inventors: HWANG, Yong-Oon, KANG, DongHo
• Application Number:
  US13/721,709
• Publication Number:
  US 20130115446A1
• Time in Patent Office: Days
• US Class Current: 428/337
• CPC Class Codes: C03C 17/00 Surface treatment of glass, not in the form of fibres or filaments, by coating optical coatings of optical elements G02B1/10
• CPC Class Codes: G02F 1/133302 Rigid substrates, e.g. inorganic substrates
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: H01B 7/00 Insulated conductors or cables characterised by their form
• CPC Class Codes: Y10T 428/266 of base or substrate

Abstract

The present invention provides configuration of a flat display panel with a touch screen panel loaded thereon and a manufacturing method thereof. According to the present invention, a configuration of a flat display panel with a touch screen panel loaded thereon in which reduced number of sheets of glass substrate or resin film substrate is provided. The configuration includes a transparent electrode integrated encapsulation module in which the transparent electrode is formed on one surface of an encapsulation glass substrate without a separate glass substrate for electrode formation of a touch screen circuit. A method for manufacturing a transparent electrode integrated encapsulation module is provided.

Claims

1. A transparent electrode integrated encapsulation module in which a transparent electrode is formed on an encapsulation glass substrate without a separate glass substrate for electrode formation of a touch screen circuit.

2. The transparent electrode integrated encapsulation module of claim 1, wherein the encapsulation glass substrate is slimmed in thickness from 0.05 to 0.5 mm, tempered in potassium nitrate (KNO₃) melted liquid at a temperature from 380 to 450°

C., and deposited with a transparent electrode formed on the encapsulation glass substrate at a temperature from 150 to 250°

C.

3. A transparent electrode integrated encapsulation module in which a transparent electrode is formed on an encapsulation glass substrate without a separate glass substrate for electrode formation of a touch screen circuit, wherein the encapsulation glass substrate is slimmed in thickness from 0.05 to 0.5 mm.