METHOD FOR FABRICATING A PROXIMITY SENSING MODULE
First Claim
1. A method for fabricating a proximity sensing module that is adapted to be attached to an inner surface of a housing of a mobile device, the method comprising:
- (a) patterning an upper conductive film to form a patterned conductive film which includes an upper connective pad that is adapted to be electrically connected to a respective contact on a circuit board of the mobile device, and an induced circuit pattern that is electrically connected to the upper connective pad;
(b) adhering an adhesive sheet to the patterned conductive film, the adhesive sheet having an area capable of covering the upper connective pad and the induced circuit pattern; and
(c) forming a first through hole in the adhesive sheet such that the upper connective pad is exposed from the first through hole.
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Accused Products
Abstract
The steps of a method for fabricating a proximity sensing module that is adapted to be attached to a mobile device, include: (a) patterning an upper conductive film to form a patterned conductive film which includes an upper connective pad that is adapted to be electrically connected to a respective contact on a circuit board of the mobile device, and an induced circuit pattern that is electrically connected to the upper connective pad; (b) adhering an adhesive sheet to the patterned conductive film; and (c) forming a through hole in the adhesive sheet such that the upper connective pad is exposed from the through hole.
6 Citations
12 Claims
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1. A method for fabricating a proximity sensing module that is adapted to be attached to an inner surface of a housing of a mobile device, the method comprising:
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(a) patterning an upper conductive film to form a patterned conductive film which includes an upper connective pad that is adapted to be electrically connected to a respective contact on a circuit board of the mobile device, and an induced circuit pattern that is electrically connected to the upper connective pad; (b) adhering an adhesive sheet to the patterned conductive film, the adhesive sheet having an area capable of covering the upper connective pad and the induced circuit pattern; and (c) forming a first through hole in the adhesive sheet such that the upper connective pad is exposed from the first through hole. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification