LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS HAVING THE SAME

• US 20130119424A1
• Filed: 11/15/2012
• Published: 05/16/2013
• Est. Priority Date: 11/16/2011
• Status: Active Grant

• Current Assignee: LG Innotek Company Limited (LG Corporation)
• Original Assignee: Deok K.I. Hwang, Hee Seok Choi, Ju Won Lee, Pil Geun Kang, Seok Beom Choi, Young J.U. Han
• Inventors: CHOI, Hee Seok, KANG, Pil Geun, CHOI, Seok Beom, LEE, Ju Won, HWANG, Deok Ki, HAN, Young Ju
• Granted Patent: US 9,397,261 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/22 Roughened surfaces, e.g. at the interface between epitaxial layers
• CPC Class Codes: H01L 33/40 Materials therefor
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

A light emitting device is provided a transmissive substrate; a first pattern portion including a protrusions; a second pattern portion including a concaves having a width smaller than a width of each protrusion; a light emitting structure under the transmissive substrate and including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer; a first electrode under the first conductive semiconductor layer; a reflective electrode layer under the second conductive semiconductor layer; a second electrode under the reflective electrode layer; a first connection electrode under the first electrode; a second connection electrode under the second electrode; and an insulating support member around the first electrode and the first connection electrode and around the second electrode and the second connection electrode and including a ceramic-based thermal diffusion agent.

Claims

1. A light emitting device comprising:

a transmissive substrate;

a first pattern portion disposed on a top surface of the transmissive substrate and including a plurality of protrusions;

a second pattern portion disposed on the top surface of the transmissive substrate and including a plurality of concaves each of which has a width smaller than a width of each protrusion;

a light emitting structure disposed under the transmissive substrate and including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers;

a first electrode under the first conductive semiconductor layer;

a reflective electrode layer under the second conductive semiconductor layer;

a second electrode under the reflective electrode layer;

a first connection electrode under the first electrode;

a second connection electrode under the second electrode; and

an insulating support member disposed around the first electrode and the first connection electrode and around the second electrode and the second connection electrode and including a ceramic-based thermal diffusion agent.

2. The light emitting device of claim 1, wherein the plurality of concaves are disposed on the protrusions, respectively.

3. The light emitting device of claim 1, wherein the plurality of protrusions have a hemispheric shape.

4. The light emitting device of claim 1, wherein the plurality of protrusions are aligned at a regular interval and the concaves are aligned at an irregular interval.

5. The light emitting device of claim 1, wherein each of the plurality of concaves has a width corresponding to 50% or less based on a width of each of the plurality of protrusions.

6. The light emitting device of claim 5, wherein the width of each of the plurality of protrusions is in a range of 0.1 μ

m to 10 μ

m.

7. The light emitting device of claim 1, further comprising a phosphor layer on the transmissive substrate, wherein a part of the phosphor layer is disposed in the plurality of concaves.

8. The light emitting device of claim 7, further comprising a transmissive resin layer between the transmissive substrate and the phosphor layer.

9. The light emitting device of claim 1, further comprising a plurality of protrusions provided on a bottom surface of the substrate.

10. The light emitting device of claim 1, wherein the ceramic-based thermal diffusion agent comprises at least one of oxide, nitride, fluoride and sulfide including at least one of Al, Cr, Si, Ti, Zn and Zr.

11. The light emitting device of claim 1, wherein a bottom surface of the support member is aligned on a same horizontal plane with bottom surfaces of the first and second connection electrodes.

12. The light emitting device of claim 1, wherein the reflective electrode layer comprises:

an ohmic contact layer making contact with the light emitting structure;

a reflective layer under the ohmic contact layer; and

a first diffusion barrier layer under the reflective layer,

wherein at least one of the first and second electrodes comprises;

a first adhesive layer bonded under the first diffusion barrier layer;

a second diffusion barrier layer under the first adhesive layer; and

a first bonding layer under the second diffusion barrier layer.

13. The light emitting device of claim 1, further comprising:

a first electrode bonding layer bonded between the first electrode and the first connection electrode; and

a second electrode bonding layer bonded between the second electrode and the second connection electrode.

14. The light emitting device of claim 13, wherein the first electrode bonding layer comprises:

a first bonding electrode bonded to the first electrode; and

a second bonding electrode bonded between the first connection electrode and the first bonding electrode, and

the second electrode bonding layer comprises;

a third bonding electrode bonded to the second electrode; and

a fourth bonding electrode bonded between the second connection electrode and the third bonding electrode.

15. A light emitting device comprising:

a first conductive semiconductor layer;

an active layer under the first conductive semiconductor layer;

a second conductive semiconductor layer under the active layer;

a first pattern portion disposed on a top surface of the first conductive semiconductor layer and including a plurality of protrusions;

a second pattern portion disposed on the top surface of the first conductive semiconductor layer and including a plurality of concaves each of which has a width smaller than a width of each protrusion;

a first electrode under the first conductive semiconductor layer;

a reflective electrode layer under the second conductive semiconductor layer;

a second electrode under the reflective electrode layer;

a first connection electrode under the first electrode;

a second connection electrode under the second electrode; and

an insulating support member disposed around the first electrode and the first connection electrode and around the second electrode and the second connection electrode and including a ceramic-based thermal diffusion agent.

16. The light emitting device of claim 15, wherein each concave has a width corresponding to 50% or less based on a width of each of the plurality of protrusions.

17. The light emitting device of claim 16, wherein the width of each of the plurality of protrusions is in a range of 0.1 μ

m to 3 μ

m.

18. The light emitting device of claim 15, wherein the ceramic-based thermal diffusion agent comprises at least one of oxide, nitride, fluoride and sulfide including at least one of Al, Cr, Si, Ti, Zn and Zr.

19. The light emitting device of claim 15, wherein a bottom surface of the support member is aligned on a same horizontal plane with bottom surfaces of the first and second connection electrodes, and

the light emitting device further comprises:

a first electrode bonding layer including a plurality of bonding electrodes bonded between the first electrode and the first connection electrode; and

a second electrode bonding layer including a plurality of bonding electrodes bonded between the second electrode and the second connection electrode.

20. A light emitting apparatus comprising:

a light emitting device including a support member formed at a lower portion of the light emitting device and first and second connection electrodes exposed to a bottom surface of the support member;

a plurality of lead frames on which the first and second connection electrodes of the light emitting device are mounted; and

a body on which the lead frames are installed,

wherein the light emitting device comprises;

a transmissive substrate;

a first pattern portion disposed on a top surface of the transmissive substrate and including a plurality of protrusions;

a second pattern portion disposed on the top surface of the transmissive substrate and including a plurality of concaves each of which has a width smaller than a width of each protrusion;

a light emitting structure disposed under the transmissive substrate and including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers;

a first electrode between the first conductive semiconductor layer and the first connection electrode;

a reflective electrode layer under the second conductive semiconductor layer; and

a second electrode between the reflective electrode layer and the second connection electrode, and

wherein the support member is disposed around the first electrode and the first connection electrode and around the second electrode and the second connection electrode and including a ceramic-based thermal diffusion agent, and

wherein the first and second connection electrodes of the light emitting device and the bottom surface of the support member have an interval corresponding to a top surface of the lead frames.