DECOUPLING DEVICE AND FABRICATING METHOD THEREOF

• US 20130120903A1
• Filed: 01/15/2012
• Published: 05/16/2013
• Est. Priority Date: 11/10/2011
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Pan, Yi-Hsiu, Cheng, Yu-Ting, Tsai, Li-Duan, Chen, Chi-Lun, Cheng, Cheng-Liang
• Granted Patent: US 8,922,976 B2
• Time in Patent Office: Days
• US Class Current: 361/306.2
• CPC Class Codes: H01G 9/048 characterised by their structure H01G11/22 takes precedence
• CPC Class Codes: H01G 9/08 Housing; Encapsulation
• CPC Class Codes: H01G 9/15 Solid electrolytic capacitors H01G11/00 takes precedence
• CPC Class Codes: H01G 9/26 Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other

Abstract

A decoupling device including a lead frame, multiple capacitor units, a protective layer and a packaging element is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions disposed at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor units are connected in parallel and disposed on the lead frame. Each capacitor unit has a cathode portion and an opposite anode portion. The cathode portion is electrically connected with the cathode terminal portion. The anode portion is electrically connected with the anode terminal portion. The protective layer wraps at least one of the anode portion and the cathode portion of the capacitor unit. The packaging element covers the lead frame, the capacitor units and the protective layer. The packaging element exposes a bottom surface of the lead frame.

Claims

1. A decoupling device, comprising:

a lead frame, comprising;

a cathode terminal portion and at least two opposite anode terminal portions disposed at two ends of the cathode terminal portion, wherein the two anode terminal portions are electrically connected with each other through a conductive line;

a plurality of capacitor units, wherein the capacitor units are connected in parallel and disposed on the lead frame, each of the capacitor units is provided with a cathode portion and an anode portion opposite to each other, the cathode portion of the capacitor unit is electrically connected with the cathode terminal portion, and the anode portion of the capacitor unit is electrically connected with the anode terminal portion;

a protective layer, for wrapping at least one of the anode portion and the cathode portion of the capacitor unit; and

a packaging element, for covering the lead frame, the capacitor units and the protective layer, wherein the packaging element exposes a bottom surface of the lead frame.

2. The decoupling device of according to claim 1, wherein a material of the protective layer PL is selected from silicon resin, silicon rubber, epoxy resin, polyimide, polytetrafluoroethylene, polyurethane, liquid crystal plastic and a combination thereof.

3. The decoupling device of according to claim 1, wherein the capacitor units are located on the same plane, arrayed in parallel with each other, and disposed on the lead frame.

4. The decoupling device of according to claim 1, wherein the capacitor units are staggered, stacked and arrayed in parallel with each other, and disposed on the lead frame.

5. The decoupling device according to claim 1, further comprising:

a plurality of conductive spacers, located between the anode portions of the capacitor units stacked with each other.

6. The decoupling device of according to claim 1, wherein the cathode terminal portion is provided with a spacing, and the conductive line is disposed in the spacing.

7. The decoupling device of according to claim 1, wherein the conductive line is a consecutive bending structure.

8. The decoupling device according to claim 1, further comprising:

a device with inductance characteristics, connected with the conductive line in series or in parallel.

9. The decoupling device of according to claim 1, wherein the cathode terminal portion further comprises a rough structure located at a surface of the cathode terminal portion.

10. The decoupling device of according to claim 1, wherein the packaging element is a packaging layer, the packaging layer partially wraps the capacitor units and the lead frame, and the packaging layer exposes bottom surfaces of the cathode terminal portion and the anode terminal portions.

11. The decoupling device according to claim 10, wherein the cathode terminal portion and each of the anode terminal portions further comprise:

an engaging structure, disposed at an edge of the cathode terminal portion and edges of the anode terminal portions, and engaged in the packaging layer.

12. The decoupling device according to claim 10, wherein the packaging layer completely wraps the conductive line, or exposes part of the conductive line.

13. The decoupling device according to claim 1, wherein the packaging element comprises:

a first lid body and a second lid body opposite to each other, the first lid body and the second lid body wrap the capacitor units, and the first lid body exposes bottom surfaces of the cathode terminal portion and the anode terminal portions.

14. The decoupling device according to claim 13, wherein the cathode terminal portion and each of the anode terminal portions further comprise:

an engaging structure, disposed at an edge of the cathode terminal portion and edges of the anode terminal portions, and engaged in the first lid body.

15. The decoupling device of according to claim 1, wherein the packaging element comprises:

a first lid body and a packaging layer, the first lid body exposes bottom surfaces of the cathode terminal portion and the anode terminal portions, the packaging layer is filled into the first lid body, and the first lid body and the packaging layer wrap the capacitor units.

16. The decoupling device according to claim 1, further comprising:

at least one ceramic capacitor, connected between the cathode terminal portion and the anode terminal portions in parallel.

17. The decoupling device according to claim 1, further comprising:

an electromagnetic wave baffle plate, covering the capacitor units at the above of the capacitor units.

18. The decoupling device according to claim 17, wherein the electromagnetic wave baffle plate is electrically connected with the capacitor units.

19. The decoupling device according to claim 1, wherein each of the capacitor units comprises:

a valve metal layer;

a dielectric layer, formed on the valve metal layer;

a conductive polymer layer, formed on the dielectric layer; and

a cathode conductive layer, formed on the conductive polymer layer.

20. The decoupling device according to claim 19, wherein each of the capacitor units is a capacitor unit with a tantalum capacitor,

the valve metal layer is made of tantalum metal, the dielectric layer is made of a tantalum oxide, the cathode conductive layer is made of a carbon paste-silver paste mixture, and

the anode portion at least comprises an extending conductive line electrically connected with the anode terminal portion.

21. The decoupling device of according to claim 19, wherein a material of the valve metal layer is selected from aluminium, tantalum, niobium, niobium oxide, titanium and a combination thereof, and the dielectric layer is a metal oxide of the valve metal layer.

22. The decoupling device according to claim 1, further comprising:

an insulating layer, disposed above the conductive line, wherein the insulating layer enables the cathode terminal portion and the anode terminal portions to be electrically insulated from each other.

23. The decoupling device according to claim 1, wherein the capacitor units are arrayed in a set direction, the anode portions of the two adjacent capacitor units are staggered with each other in a predetermined spacer number D, and D is larger than or equal to 1.

24. The decoupling device according to claim 1, wherein the cathode terminal portion and the anode terminal portions comprise a plurality of terminal structures, the terminal structures are arrayed adjacent to each other, and the anode portions and the cathode portions of the adjacent capacitor units are arrayed alternately.

25. A decoupling device fabricating method, comprising:

providing a lead frame comprising;

a cathode terminal portion and at least two opposite anode terminal portions disposed at two ends of the cathode terminal portion, wherein the two anode terminal portions are electrically connected with each other through a conductive line;

providing a plurality of capacitor units, wherein the capacitor units are connected in parallel and disposed on the lead frame, each of the capacitor units is provided with a cathode portion and an anode portion opposite to each other, the cathode portion of the capacitor unit is electrically connected with the cathode terminal portion, and the anode portion of the capacitor unit is electrically connected with the anode terminal portion;

providing a protective layer for wrapping at least one of the anode portion and the cathode portion of the capacitor unit; and

providing a packaging element for covering the lead frame, the capacitor units and the protective layer, wherein the packaging element exposes a bottom surface of the lead frame.