LIGHT EMITTING DEVICE AND LIGHTING APPARATUS HAVING THE SAME

• US 20130121000A1
• Filed: 11/09/2012
• Published: 05/16/2013
• Est. Priority Date: 11/16/2011
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: Bong Kul Min, Gyu Hyeong Bak, Song Eun Lee
• Inventors: Bak, Gyu Hyeong, Min, Bong Kul, LEE, Song Eun
• Granted Patent: US 9,231,166 B2
• Time in Patent Office: Days
• US Class Current: 362/293
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Disclosed are a light emitting device and a lighting apparatus having the same. The light emitting device includes a plurality of lead frames, a first body having reflectance, disposed on top surfaces of the lead frames and having an open region at a predetermined region of the top surfaces of the lead frames, a second body having transmittance, having a first opening corresponding to the open region of the first body, and disposed on a top surface of the first body, a light emitting chip on at least one of the lead frames exposed in the first opening of the second body, and a first resin layer disposed in the first opening of the second body to cover the light emitting chip.

Claims

1. A light emitting device comprising:

a plurality of lead frames;

a first body having a higher reflectance than transmittance, disposed on top surfaces of the lead frames and having an open region at a predetermined region of the top surfaces of the plurality of lead frames;

a second body having a higher transmittance than reflectance, having a first opening corresponding to the open region of the first body, and disposed on a top surface of the first body;

a light emitting chip on at least one of the plurality lead frames exposed in the first opening of the second body; and

a first resin layer disposed in the first opening of the second body to cover the light emitting chip.

2. The light emitting device of claim 1, wherein the top surface of the first body makes contact with a bottom surface of the second body, and has a height lower than a height of a top surface of the light emitting chip.

3. The light emitting device of claim 2, wherein the first body includes an inner region adjacent to the light emitting chip and an outer region which is thicker than the inner region and extends from the inner region.

4. The light emitting device of claim 3, wherein a top surface of the inner region of the first body is inclined at an angle of 65°

to 89°

about a perpendicular line to the light emitting chip.

5. The light emitting device of claim 4, wherein a top surface of the outer region of the first body has a height lower than a height of the top surface of the light emitting chip.

6. The light emitting device of claim 5, wherein a first lead frame of the plurality of lead frames is disposed under the light emitting chip, includes a first groove recessed at a peripheral portion of the light emitting chip and a plurality of holes disposed around the first groove, and wherein the first body is disposed in the first groove and the plurality of holes.

7. The light emitting device of claim 1, wherein the plurality of lead frames include a second lead frame spaced apart from the first lead frame and electrically connected to the light emitting chip, wherein the second lead frame includes a second groove, which is disposed adjacent to the first opening and has a shape of a line having a width longer than a width of the first opening, and a plurality of second holes disposed outside the second groove, the first body is disposed in the second groove and the plurality of second holes, and the plurality of second holes have a lower portion having a width wider than a width of an upper portion thereof.

8. The light emitting device of claim 1, wherein the first body includes a gap part disposed between the plurality of lead frames, and the gap part has a wider lower portion and a narrower upper portion.

9. The light emitting device of claim 1, wherein the first and second bodies include materials different from each other.

10. The light emitting device of claim 9, wherein the first body includes a white resin material, and the second body includes a transmissive silicon material or a transmissive epoxy resin material.

11. The light emitting device of claim 10, wherein the first body includes a material having at least 70% of reflectance with respect to a wavelength emitted from the light emitting chip, and the second body includes a material having at least 70% of transmittance with respect to a wavelength emitted from the light emitting chip.

12. The light emitting device of claim 1, wherein the second body includes an inner side portion being closer to the light emitting chip than an inner region of the first body and making contact with the lead frames exposed to the open region of the first body.

13. The light emitting device of claim 1, further comprising a phosphor disposed in the first resin layer and disposed on a top surface of the light emitting chip.

14. The light emitting device of claim 13, further comprising an optical lens disposed on the first resin layer and the second body, and a plurality of protrusions protruding from an upper portion of the second body and coupled with the optical lens.

15. The light emitting device of claim 14, further comprising a second resin layer between the first resin layer and the optical lens.

16. The light emitting device of claim 14, wherein the optical lens includes a concave part having an upper center concave toward the light emitting chip.

17. The light emitting chip of claim 1, wherein the first and second bodies include a second opening spaced apart from the first opening, a bottom surface of the second opening exposes the plurality of lead frames, and a protective device is disposed on at least one of the plurality of lead frames exposed through the second opening.

18. The light emitting device of claim 1, further comprising a transmissive adhesive layer between the first and second bodies.

19. A light emitting device comprising:

a first lead frame having a cavity;

a second lead frame spaced apart from the first lead frame;

a first body having a higher reflectance than transmittance, disposed on the first and second lead frames, and exposing a predetermined region of top surfaces of the first and second lead frames;

a second body having a higher transmittance than reflectance, having a first opening corresponding to a central region of the first body, and disposed on a top surface of the first body;

a light emitting chip disposed in a cavity of the first lead frame and electrically connected to the first and second lead frames; and

a first resin layer in the cavity.

20. The light emitting device of claim 19, wherein the first lead frame includes a first connection part exposed to the central region of the first body and a first lead part extending from the first connection part to a bottom surface of the body, and the second lead frame includes a second connection part exposed to the central region of the first body and a second lead part extending from the second connection part to the bottom surface of the body.