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SYSTEMS AND METHODS FOR SUBSTRATE POLISHING END POINT DETECTION USING IMPROVED FRICTION MEASUREMENT

  • US 20130122782A1
  • Filed: 04/27/2012
  • Published: 05/16/2013
  • Est. Priority Date: 11/16/2011
  • Status: Active Grant
First Claim
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1. An apparatus for polishing a substrate, the apparatus comprising:

  • an upper platen;

    a torque/strain measurement instrument coupled to the upper platen; and

    a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument.

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