SYSTEMS AND METHODS FOR SUBSTRATE POLISHING END POINT DETECTION USING IMPROVED FRICTION MEASUREMENT
First Claim
1. An apparatus for polishing a substrate, the apparatus comprising:
- an upper platen;
a torque/strain measurement instrument coupled to the upper platen; and
a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument.
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Abstract
Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.
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Citations
20 Claims
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1. An apparatus for polishing a substrate, the apparatus comprising:
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an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A system for chemical-mechanical planarization processing of substrates, the system comprising:
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a polishing head adapted to hold a substrate; and a polishing pad support adapted to hold and rotate a polishing pad against the substrate held in the polishing head, the polishing pad support including; an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method of polishing a substrate, the method comprising:
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coupling a lower platen to an upper platen via a torque/strain measurement instrument, the upper platen adapted to hold a polishing pad; rotating the lower platen to drive the upper platen; applying a polishing head holding a substrate to the polishing pad on the upper platen; and measuring an amount of torque needed to rotate the upper platen as the substrate is polished. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification