HERMETICALLY SEALED GLASS PACKAGE AND METHOD OF MANUFACTURE

• US 20130125516A1
• Filed: 01/14/2013
• Published: 05/23/2013
• Est. Priority Date: 12/06/2005
• Status: Abandoned Application

• Current Assignee: Aiyu Zhang, John Frederick Bayne, Keith James Becken, Stephan Lvovich Logunov
• Original Assignee: Aiyu Zhang, John Frederick Bayne, Keith James Becken, Stephan Lvovich Logunov
• Inventors: Bayne, John Frederick, Becken, Keith James, Logunov, Stephan Lvovich, Zhang, Aiyu
• Application Number:
  US13/741,060
• Publication Number:
  US 20130125516A1
• Time in Patent Office: Days
• US Class Current: 53/477
• CPC Class Codes: B65B 7/00 Closing containers or receptacles after filling
• CPC Class Codes: C03C 27/06 Joining glass to glass by processes other than fusing fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

A method for manufacturing a hermetically sealed package is provided, using a laser to heat a frit, disposed in a pattern between two substrates, such that the heated frit forms a hermetic seal which connects the substrates.

Claims

1. A method for manufacturing a hermetically sealed package using a laser to heat a frit, disposed in a pattern between two substrates, such that the heated frit forms a hermetic seal which connects the substrates, the method comprising the steps of:

directing the laser to enter the frit pattern, to trace the frit pattern, to retrace a portion of the frit pattern, and to exit the frit pattern; and

selecting an initial laser power which, when the laser enters the frit pattern, is insufficient to heat the frit to form a hermetic seal;

increasing the laser power over a first section of the frit pattern to a target laser power at least sufficient to cause the frit to form a hermetic seal; and

decreasing the laser power over a second section of the frit pattern until the laser power is insufficient to cause the frit to form a hermetic seal before the laser exits the frit pattern.

2. The method of claim 1 wherein the substrates comprise plates.

3. The method of claim 1 wherein the first section of the frit pattern, over which the laser power is increased, is at least about 3 mm in length.

4. The method of claim 1 wherein the first section of the frit pattern, over which the laser power is increased, is at least about 5 mm in length.

5. The method of claim 1 wherein the first section of the frit pattern, over which the laser power is increased, is at least about 10 mm in length.

6. The method of claim 1 wherein the second section of the frit pattern, over which the laser power is decreased, is at least about 5 mm in length.

7. The method of claim 1 wherein the second section of the frit pattern, over which the laser power is decreased is at least about 7 mm in length.

8. The method of claim 1 wherein the second section of the frit pattern over which the laser power is decreased is at least about 10 mm in length.

9. The method of claim 1 wherein the second section of the frit pattern does not overlap the first section of the frit pattern.

10. The method of claim 1 wherein the second section of the frit pattern begins at a location of the frit pattern where the laser power was first increased to the target power sufficient to cause the frit to form a hermetic seal.

11. The method of claim 1 wherein the second section of the frit pattern overlaps at least a portion of the first section of the frit pattern.

12. A package comprising:

a first substrate;

a second substrate; and

a hermetic seal connecting the first and second substrates, wherein the hermetic seal is formed by a frit disposed in a pattern between the two substrates and heated by a laser, and wherein heated by a laser comprises;

directing the laser to enter the frit pattern, to trace the frit pattern, to retrace a portion of the frit pattern, and to exit the frit pattern; and

further comprises

selecting an initial laser power which, when the laser enters the frit pattern, is insufficient to heat the frit to form a hermetic seal;

increasing the laser power over a first section of the frit pattern to a target laser power at least sufficient to cause the frit to form a hermetic seal; and

decreasing the laser power over a second section of the frit pattern until the laser power is insufficient to cause the frit to form a hermetic seal before the laser exits the frit pattern.

13. The package of claim 12 wherein the first and second substrates comprise plates.

14. The method of claim 12 wherein the first section of the frit pattern, over which the laser power is increased, is at least about 3 mm in length.

15. The method of claim 12 wherein the first section of the frit pattern, over which the laser power is increased, is at least about 5 mm in length.

16. The method of claim 12 wherein the first section of the frit pattern, over which the laser power is increased, is at least about 10 mm in length.

17. The package of claim 12 wherein the second section of the frit pattern, over which the laser power is decreased, is at least about 5 mm in length.

18. The method of claim 12 wherein the second section of the frit pattern, over which the laser power is decreased, is at least about 7 mm in length.

19. The method of claim 12 wherein the second section of the frit pattern, over which the laser power is decreased, is at least about 10 mm in length.

20. The package of claim 12 wherein the second section of the frit pattern does not overlap the first section of the frit pattern.

21. The package of claim 12 wherein the second section of the frit pattern, over which the laser power is decreased, begins at a location of the frit pattern where the laser power was first increased to the target power sufficient to cause the frit to form a hermetic seal.

22. The package of claim 12 wherein the second section overlaps at least a portion of the first section of the frit pattern.