ORGANIC ELECTROLUMINESCENT DEVICE
First Claim
1. An organic electroluminescent device comprising an electroluminescent layer stack on top of a substrate and a cover lid encapsulating the electroluminescent layer stack, wherein the cover lid comprises at least one electrical feedthrough to electrically contact the electroluminescent layer stack and at least one fastening element, the at least one fastening element being arranged to fasten the organic electroluminescent device to a housing such that forces applied to the cover lid during fastening of the housing are minimized by transferring the forces via the side walls of the coverlid to the substrate such that bending of a backside of the cover lid is reduced.
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Accused Products
Abstract
The invention relates to an organic electroluminescent device (1), which is easily connectable to a socket in a cost-effective and reliable way. The organic electroluminescent device (1) comprising an electroluminescent layer stack (3, 4, 5) on top of a substrate (2) and a cover lid (6) encapsulating the electroluminescent layer stack (3, 4, 5), wherein the cover lid (6) comprises a least one electrical feedthrough (61) to electrically contact the electroluminescent layer stack (3, 4, 5) and at least one fastening element (62), where the at least one fastening element (62) is arranged to fasten the organic electroluminescent device (1) to a housing (8) such that forces to a backside of the cover lid (6b) during fastening of the housing (8) are minimized.
18 Citations
17 Claims
- 1. An organic electroluminescent device comprising an electroluminescent layer stack on top of a substrate and a cover lid encapsulating the electroluminescent layer stack, wherein the cover lid comprises at least one electrical feedthrough to electrically contact the electroluminescent layer stack and at least one fastening element, the at least one fastening element being arranged to fasten the organic electroluminescent device to a housing such that forces applied to the cover lid during fastening of the housing are minimized by transferring the forces via the side walls of the coverlid to the substrate such that bending of a backside of the cover lid is reduced.
Specification