MEMS Chip Package and Method for Manufacturing an MEMS Chip Package

• US 20130126992A1
• Filed: 11/21/2012
• Published: 05/23/2013
• Est. Priority Date: 11/22/2011
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Ehrenpfordt, Ricardo, Bruendel, Mathias, Gerlach, Andre, Leinenbach, Christina, Knies, Sonja, Feyh, Ando, Scholz, Ulrike
• Granted Patent: US 8,981,499 B2
• Time in Patent Office: Days
• US Class Current: 257/416
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 3/0067 Mechanical properties
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 1/00325 for reducing stress inside of the package structure

Abstract

A MEMS chip package includes a first chip, a second chip, a first coupling element, and a first redistribution layer. The first chip has a first chip surface and a second chip surface, which is opposite the first chip surface. The second chip has a first chip surface and a second chip surface, which is opposite the first chip surface. The first coupling element couples the first chip surface of the second chip to the first chip surface of the first chip, so that a first cavity is defined between the first chip and the second chip. The first redistribution layer is mounted on the second chip surface of the second chip and is configured to provide contact with a substrate.

Claims

1. A MEMS chip package, comprising:

a first chip having a first chip surface and a second chip surface, which is opposite the first chip surface;

a second chip having a first chip surface and a second chip surface, which is opposite the first chip surface;

a first coupling element, which couples the first chip surface of the second chip to the first chip surface of the first chip, so that a first cavity is defined between the first chip and the second chip; and

a first redistribution layer, which is mounted on the second chip surface of the second chip and which is configured to provide contact with a substrate,

wherein a chip from the group comprising the first chip and the second chip has (i) at least one microelectromechanical structure element which is produced on the first chip surface, and (ii) a frame element, produced between the first chip surface and the second chip surface, which encloses the microelectromechanical structure element, and

wherein the respective other chip from the group comprising the first chip and second chip has (i) a potting compound layer, (ii) a control circuit, embedded in the potting compound layer, which is configured to drive the at least one microelectromechanical structure element, and (iii) a third redistribution layer, which is mounted on the first chip surface.

2. The MEMS chip package according to claim 1, wherein:

the chip having the microelectromechanical structure element also has (i) a first covering layer, mounted on the second chip surface on the frame element, and (ii) a second redistribution layer, produced on the first chip surface, and

at least one second cavity is defined between the first covering layer and the at least one microelectromechanical structure element.

3. The MEMS chip package according to claim 1, wherein:

the first chip surface of the second chip and the first chip surface of the first chip have an essentially congruent area, and

the second chip has at least one electrical plated-through hole running between the first and second chip surfaces.

4. The MEMS chip package according to claim 1, wherein the first coupling element has an element from the group comprising an underfill material, an adhesive from a sealing ring made of solder material, FC contacts, or combinations thereof.

5. The MEMS chip package according to claim 1, wherein the at least one microelectromechanical structure element has a microelectromechanical loudspeaker element or a microelectromechanical microphone element.

6. The MEMS chip package according to claim 2, wherein the first covering layer is acoustically transparent.

7. The MEMS chip package according to claim 2, wherein:

the first covering layer is coupled to the at least one microelectromechanical structure element, and

the first covering layer produces a multiplicity of second cavities.

8. The MEMS chip package according to claim 2, further comprising:

a second covering layer, which is arranged on the first covering layer.

9. The MEMS chip package according to claim 8, wherein:

the second covering layer is acoustically nontransparent, and

the second covering layer has at least one passage hole.

10. The MEMS chip package according to claim 1, further comprising:

a third covering layer, which is arranged on the second chip surface of the chip with the control circuit or on a surface of the substrate, and

wherein the substrate is coupled to the first redistribution layer.

11. The MEMS chip package according to claim 10, wherein:

the substrate has a cutout in the region of the second chip, and

the second chip has at least one passage hole.

12. A method for manufacturing an MEMS chip package, comprising:

coupling a first chip, which has a first chip surface and a second chip surface, which is opposite the first chip surface, to a second chip, which has a first chip surface and a second chip surface, which is opposite the first chip surface, by means of a coupling element which couples the first chip surface of the second chip to the first chip surface of the first chip, so that a first cavity is defined between the first chip and the second chip,

wherein a chip from the group comprising the first chip and second chip has (i) at least one microelectromechanical structure element which is produced on the first chip surface, and (ii) a frame element, produced between the first and second chip surfaces, which encloses the microelectromechanical structure element, and

wherein the respective other chip from the group comprising the first chip and the second chip has (i) a potting compound layer, (ii) a control circuit, embedded in the potting compound layer, which is configured to drive the at least one microelectromechanical structure element, and (iii) a third redistribution layer, which is mounted on the first chip surface.

13. The method according to claim 12, further comprising:

coupling a first redistribution layer, which is mounted on the second chip surface of the second chip, to a substrate.

14. The method according to claim 12, wherein:

the chip having the microelectromechanical structure element also has a first covering layer, which is mounted on the second chip surface on the frame element, and

at least one second cavity is defined between the first covering layer and the at least one microelectromechanical structure element.